- Series :
- Part Status :
- Packaging :
- Operating Temperature :
- Type :
-
- CLCC (4)
- DIP, 0.3" (7.62mm) Row Spacing (28)
- DIP, 0.4" (10.16mm) Row Spacing (4)
- DIP, 0.6" (15.24mm) Row Spacing (19)
- DIP, ZIF (ZIP) (1)
- DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing (1)
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing (3)
- PGA, ZIF (ZIP) (9)
- PLCC (1)
- QFN (15)
- QFP (1)
- SIP, ZIF (ZIP) (5)
- SOIC (9)
- Transistor, TO-3 and TO-66 (1)
- Zig-Zag (2)
- Zig-Zag, ZIF (ZIP) (12)
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (1)
- 10 (2 x 5) (2)
- 100 (10 x 10) (1)
- 100 (4 x 25) (1)
- 121 (11 x 11) (1)
- 14 (2 x 7) (5)
- 16 (2 x 8) (7)
- 16 (4 x 4) (1)
- 169 (13 x 13) (1)
- 18 (2 x 9) (5)
- 20 (1 x 20) (1)
- 20 (2 x 10) (6)
- 22 (2 x 11) (2)
- 24 (1 x 24) (1)
- 24 (2 x 12) (8)
- 24 (4 x 6) (1)
- 28 (2 x 14) (8)
- 28 (4 x 7) (1)
- 289 (17 x 17) (1)
- 3 (Rectangular) (1)
- 32 (1 x 32) (1)
- 32 (2 x 16) (7)
- 32 (4 x 8) (1)
- 34 (1 x 34) (1)
- 34 (2 x 17) (3)
- 35 (1 x 17, 1 x 18) (4)
- 36 (1 x 36) (1)
- 361 (19 x 19) (1)
- 39 (1 x 19, 1 x 20) (2)
- 40 (2 x 20) (5)
- 40 (4 x 10) (2)
- 42 (2 x 21) (2)
- 441 (21 x 21) (1)
- 48 (2 x 24) (2)
- 48 (4 x 12) (3)
- 51 (1 x 25, 1 x 26) (4)
- 56 (4 x 14) (1)
- 6 (2 x 3) (2)
- 60 (4 x 15) (2)
- 625 (25 x 25) (1)
- 64 (4 x 16) (1)
- 68 (4 x 17) (4)
- 8 (2 x 4) (5)
- 80 (4 x 20) (1)
- 84 (4 x 21) (1)
- 88 (4 x 22) (1)
- 90 (2 x 45) (1)
- Applied Filters :
115 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
|
VIEW |
3,406
In-stock
|
3M | CONN SOCKET CLCC 68POS GOLD | OEM | Discontinued at Digi-Key | Tray | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | CLCC | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 68 (4 x 17) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | |||
|
VIEW |
2,908
In-stock
|
3M | CONN SOCKET CLCC 68POS GOLD | OEM | Discontinued at Digi-Key | Tray | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | CLCC | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 68 (4 x 17) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | |||
|
VIEW |
1,245
In-stock
|
3M | CONN SOCKET CLCC 68POS GOLD | OEM | Discontinued at Digi-Key | Tray | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | CLCC | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 68 (4 x 17) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | |||
|
VIEW |
906
In-stock
|
3M | CONN SOCKET PQFP 100POS TIN-LEAD | OEM | Obsolete | Bulk | 0°C ~ 105°C | Through Hole | Solder | Open Frame | QFP | Polyethersulfone (PES), Glass Filled | - | Tin-Lead | 200.0µin (5.08µm) | 100 (4 x 25) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
2,161
In-stock
|
3M | CONN IC DIP SOCKET ZIF 40POS GLD | OEM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | |||
|
|
VIEW |
806
In-stock
|
3M | CONN IC DIP SOCKET ZIF 20POS GLD | OEM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | |||
|
|
VIEW |
1,267
In-stock
|
3M | CONN ZIG-ZAG 39POS GOLD | - | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Zig-Zag | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 39 (1 x 19, 1 x 20) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | |||
|
|
VIEW |
2,639
In-stock
|
3M | CONN ZIG-ZAG 39POS GOLD | - | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Zig-Zag | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 39 (1 x 19, 1 x 20) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | |||
|
|
VIEW |
1,073
In-stock
|
3M | CONN IC DIP SOCKET 28POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
|
|
VIEW |
2,180
In-stock
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
|
|
VIEW |
2,373
In-stock
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
|
|
VIEW |
1,639
In-stock
|
3M | CONN IC DIP SOCKET 48POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
|
|
VIEW |
2,207
In-stock
|
3M | CONN IC DIP SOCKET 42POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
|
|
VIEW |
2,933
In-stock
|
3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
|
|
VIEW |
3,079
In-stock
|
3M | CONN ZIG-ZAG ZIF 51POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 51 (1 x 25, 1 x 26) | Beryllium Copper | 0.050" (1.27mm) | Beryllium Copper | |||
|
|
VIEW |
1,594
In-stock
|
3M | CONN ZIG-ZAG ZIF 51POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 51 (1 x 25, 1 x 26) | Beryllium Copper | 0.050" (1.27mm) | Beryllium Copper | |||
|
|
VIEW |
2,994
In-stock
|
3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
|
|
VIEW |
2,183
In-stock
|
3M | CONN IC DIP SOCKET 32POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
|
|
VIEW |
3,440
In-stock
|
3M | CONN IC DIP SOCKET 32POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
|
|
VIEW |
1,585
In-stock
|
3M | CONN IC DIP SOCKET 28POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
|
|
VIEW |
3,029
In-stock
|
3M | CONN IC DIP SOCKET 28POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
|
|
VIEW |
2,054
In-stock
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
|
|
VIEW |
1,985
In-stock
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
|
|
VIEW |
3,431
In-stock
|
3M | CONN IC DIP SOCKET 22POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 22 (2 x 11) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
|
|
VIEW |
3,019
In-stock
|
3M | CONN IC DIP SOCKET 20POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
|
|
VIEW |
2,281
In-stock
|
3M | CONN IC DIP SOCKET 20POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
|
|
VIEW |
2,853
In-stock
|
3M | CONN IC DIP SOCKET 18POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 18 (2 x 9) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
|
|
VIEW |
2,178
In-stock
|
3M | CONN IC DIP SOCKET 18POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 18 (2 x 9) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
|
|
VIEW |
1,446
In-stock
|
3M | CONN IC DIP SOCKET 16POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
|
|
VIEW |
959
In-stock
|
3M | CONN IC DIP SOCKET 16POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | Brass | |||
