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TS7003ITD833T

Integrated Circuits (ICs) 8-WDFN Exposed Pad

Manufacturer No:: TS7003ITD833T

Manufacturer:: Silicon Labs

Product Category:: Data Acquisition - Analog to Digital Converters (ADC)

Description:: IC ADC 12BIT SGL 300KSPS 8TDFN

RoHs Status:: Lead Free / RoHS Compliant

Datasheet:: TS7003ITD833T Datasheet(PDF)

Product Category :	Data Acquisition - Analog to Digital Converters (ADC)	Manufacturer :	Silicon Labs
Architecture :	SAR	Configuration :	S/H-ADC
Data Interface :	SPI	Features :	-
Input Type :	Single Ended	Number of A/D Converters :	1
Number of Bits :	12	Number of Inputs :	1
Operating Temperature :	-40°C ~ 85°C	Package / Case :	8-WDFN Exposed Pad
Packaging :	Tape & Reel (TR)	Part Status :	Obsolete
Ratio - S/H:ADC :	1:1	Reference Type :	Internal
Sampling Rate (Per Second) :	300k	Series :	-
Supplier Device Package :	8-TDFN (3x3)	Voltage - Supply, Analog :	2.7 V ~ 3.6 V
Voltage - Supply, Digital :	2.7 V ~ 3.6 V

TS7003ITD833T has the following characteristics

TS7003ITD833Tis produced bySilicon Labs, belongs to Data Acquisition - Analog to Digital Converters (ADC), and its best working temperature is -40°C ~ 85°C, the size is 8-WDFN Exposed Pad, and Tape & Reel (TR) is its most common packaging method, which belongs to the - series, using 8-TDFN (3x3).

TS7003ITD833T Product Detail:

TS7003ITD833T is a Data Acquisition - Analog to Digital Converters (ADC), Buffer Amps, Designed and produced by Silicon Labs. The TS7003ITD833T produced by Silicon Labs can be purchased on the website of Dyethin. Here you can find various types of electronic parts from leading manufacturers worldwide. The TS7003ITD833T of Dyethin has undergone strict quality control and meets all the requirements. The inventory status marked on Dyethin is for reference only. If you haven’t found the part you are looking for, you can contact us for more information, such as the inventory quantity of the TS7003ITD833T Datasheet （PDF)， TS7003ITD833T price, TS7003ITD833T pinout, TS7003ITD833T manual, and TS7003ITD833T replacement Solution.

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