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M2S060TS-FCS325

Integrated Circuits (ICs) 325-TFBGA

Manufacturer No:: M2S060TS-FCS325

Manufacturer:: Microsemi Corporation

Product Category:: Embedded - System On Chip (SoC)

Description:: IC FPGA SOC 60K LUTS

RoHs Status:

Datasheet:: M2S060TS-FCS325 Datasheet(PDF)

Product Category :	Embedded - System On Chip (SoC)	Manufacturer :	Microsemi Corporation
Architecture :	MCU, FPGA	Connectivity :	CAN, Ethernet, I²C, SPI, UART/USART, USB
Core Processor :	ARM® Cortex®-M3	Flash Size :	256Kb
Operating Temperature :	0°C ~ 85°C (TJ)	Package / Case :	325-TFBGA
Packaging :	Tray	Part Status :	Active
Peripherals :	DDR, PCIe, SERDES	Primary Attributes :	FPGA - 60K Logic Modules
RAM Size :	64kb	Series :	SmartFusion®2
Speed :	166MHz	Supplier Device Package :	325-BGA (11x11)

M2S060TS-FCS325 has the following characteristics

M2S060TS-FCS325is produced byMicrosemi Corporation, belongs to Embedded - System On Chip (SoC), the type of connection includes CAN, Ethernet, I²C, SPI, UART/USART, USB, it belongs to ARM® Cortex®-M3, and its best working temperature is 0°C ~ 85°C (TJ), the size is 325-TFBGA, and Tray is its most common packaging method, which belongs to the SmartFusion®2 series, and has the speed of 166MHz, using 325-BGA (11x11).

M2S060TS-FCS325 Product Detail:

M2S060TS-FCS325 is a Embedded - System On Chip (SoC), Buffer Amps, Designed and produced by Microsemi Corporation. The M2S060TS-FCS325 produced by Microsemi Corporation can be purchased on the website of Dyethin. Here you can find various types of electronic parts from leading manufacturers worldwide. The M2S060TS-FCS325 of Dyethin has undergone strict quality control and meets all the requirements. The inventory status marked on Dyethin is for reference only. If you haven’t found the part you are looking for, you can contact us for more information, such as the inventory quantity of the M2S060TS-FCS325 Datasheet （PDF)， M2S060TS-FCS325 price, M2S060TS-FCS325 pinout, M2S060TS-FCS325 manual, and M2S060TS-FCS325 replacement Solution.

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