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M2S060-FGG676

Integrated Circuits (ICs) 676-BGA

Manufacturer No:: M2S060-FGG676

Manufacturer:: Microsemi Corporation

Product Category:: Embedded - System On Chip (SoC)

Description:: IC FPGA SOC 60K LUTS

RoHs Status:: Lead Free / RoHS Compliant

Datasheet:: M2S060-FGG676 Datasheet(PDF)

Product Category :	Embedded - System On Chip (SoC)	Manufacturer :	Microsemi Corporation
Architecture :	MCU, FPGA	Connectivity :	CAN, Ethernet, I²C, SPI, UART/USART, USB
Core Processor :	ARM® Cortex®-M3	Flash Size :	256Kb
Operating Temperature :	0°C ~ 85°C (TJ)	Package / Case :	676-BGA
Packaging :	Tray	Part Status :	Active
Peripherals :	DDR, PCIe, SERDES	Primary Attributes :	FPGA - 60K Logic Modules
RAM Size :	64kb	Series :	SmartFusion®2
Speed :	166MHz	Supplier Device Package :	676-FBGA (27x27)

M2S060-FGG676 has the following characteristics

M2S060-FGG676is produced byMicrosemi Corporation, belongs to Embedded - System On Chip (SoC), the type of connection includes CAN, Ethernet, I²C, SPI, UART/USART, USB, it belongs to ARM® Cortex®-M3, and its best working temperature is 0°C ~ 85°C (TJ), the size is 676-BGA, and Tray is its most common packaging method, which belongs to the SmartFusion®2 series, and has the speed of 166MHz, using 676-FBGA (27x27).

M2S060-FGG676 Product Detail:

M2S060-FGG676 is a Embedded - System On Chip (SoC), Buffer Amps, Designed and produced by Microsemi Corporation. The M2S060-FGG676 produced by Microsemi Corporation can be purchased on the website of Dyethin. Here you can find various types of electronic parts from leading manufacturers worldwide. The M2S060-FGG676 of Dyethin has undergone strict quality control and meets all the requirements. The inventory status marked on Dyethin is for reference only. If you haven’t found the part you are looking for, you can contact us for more information, such as the inventory quantity of the M2S060-FGG676 Datasheet （PDF)， M2S060-FGG676 price, M2S060-FGG676 pinout, M2S060-FGG676 manual, and M2S060-FGG676 replacement Solution.

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