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M2S050-1FCS325I

Integrated Circuits (ICs) 325-TFBGA

Manufacturer No:: M2S050-1FCS325I

Manufacturer:: Microsemi Corporation

Product Category:: Embedded - System On Chip (SoC)

Description:: IC FPGA SOC 50K LUTS

RoHs Status:

Datasheet:: M2S050-1FCS325I Datasheet(PDF)

Product Category :	Embedded - System On Chip (SoC)	Manufacturer :	Microsemi Corporation
Architecture :	MCU, FPGA	Connectivity :	CAN, Ethernet, I²C, SPI, UART/USART, USB
Core Processor :	ARM® Cortex®-M3	Flash Size :	256Kb
Operating Temperature :	-40°C ~ 100°C (TJ)	Package / Case :	325-TFBGA
Packaging :	Tray	Part Status :	Active
Peripherals :	DDR, PCIe, SERDES	Primary Attributes :	FPGA - 50K Logic Modules
RAM Size :	64kb	Series :	SmartFusion®2
Speed :	166MHz	Supplier Device Package :	325-BGA (11x11)

M2S050-1FCS325I has the following characteristics

M2S050-1FCS325Iis produced byMicrosemi Corporation, belongs to Embedded - System On Chip (SoC), the type of connection includes CAN, Ethernet, I²C, SPI, UART/USART, USB, it belongs to ARM® Cortex®-M3, and its best working temperature is -40°C ~ 100°C (TJ), the size is 325-TFBGA, and Tray is its most common packaging method, which belongs to the SmartFusion®2 series, and has the speed of 166MHz, using 325-BGA (11x11).

M2S050-1FCS325I Product Detail:

M2S050-1FCS325I is a Embedded - System On Chip (SoC), Buffer Amps, Designed and produced by Microsemi Corporation. The M2S050-1FCS325I produced by Microsemi Corporation can be purchased on the website of Dyethin. Here you can find various types of electronic parts from leading manufacturers worldwide. The M2S050-1FCS325I of Dyethin has undergone strict quality control and meets all the requirements. The inventory status marked on Dyethin is for reference only. If you haven’t found the part you are looking for, you can contact us for more information, such as the inventory quantity of the M2S050-1FCS325I Datasheet （PDF)， M2S050-1FCS325I price, M2S050-1FCS325I pinout, M2S050-1FCS325I manual, and M2S050-1FCS325I replacement Solution.

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