BGM1032N7E6327XUSA1
RF/IF and RFID 6-WDFN Exposed Pad
- Manufacturer No:
- BGM1032N7E6327XUSA1
- Manufacturer:
- Infineon Technologies
- Product Category:
- RF Misc ICs and Modules
- Description:
- MODULE GPS FRONT-END TSNP-7-10
- RoHs Status:
Lead Free / RoHS Compliant
- Datasheet:
-
BGM1032N7E6327XUSA1 Datasheet(PDF)
BGM1032N7E6327XUSA1 Product Detail:
BGM1032N7E6327XUSA1 is a RF Misc ICs and Modules, Buffer Amps, Designed and produced by Infineon Technologies. The BGM1032N7E6327XUSA1 produced by Infineon Technologies can be purchased on the website of Dyethin. Here you can find various types of electronic parts from leading manufacturers worldwide. The BGM1032N7E6327XUSA1 of Dyethin has undergone strict quality control and meets all the requirements. The inventory status marked on Dyethin is for reference only. If you haven’t found the part you are looking for, you can contact us for more information, such as the inventory quantity of the BGM1032N7E6327XUSA1 Datasheet （PDF)， BGM1032N7E6327XUSA1 price, BGM1032N7E6327XUSA1 pinout, BGM1032N7E6327XUSA1 manual, and BGM1032N7E6327XUSA1 replacement Solution.
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Contains "BGM1" series products
