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BDN09-3CB

Fans, Thermal Management

Manufacturer No:: BDN09-3CB

Manufacturer:: CTS Thermal Management Products

Product Category:: Thermal - Heat Sinks

Description:: HEATSINK CPU .91" SQ

RoHs Status:: Lead Free / RoHS Compliant

Datasheet:: PDF
Data sheet

Product Category :	Thermal - Heat Sinks	Manufacturer :	CTS Thermal Management Products
Attachment Method :	Thermal Tape, Adhesive (Not Included)	Diameter :	-
Height Off Base (Height of Fin) :	0.355" (9.02mm)	Length :	0.910" (23.11mm)
Material :	Aluminum	Material Finish :	Black Anodized
Package Cooled :	Assorted (BGA, LGA, CPU, ASIC...)	Part Status :	Active
Power Dissipation @ Temperature Rise :	-	Series :	BDN
Shape :	Square, Pin Fins	Thermal Resistance @ Forced Air Flow :	9.60°C/W @ 400 LFM
Thermal Resistance @ Natural :	26.90°C/W	Type :	Top Mount
Width :	0.910" (23.11mm)

BDN09-3CB has the following characteristics

BDN09-3CBis produced byCTS Thermal Management Products, belongs to Thermal - Heat Sinks, which belongs to the BDN series.

BDN09-3CB Product Detail:

BDN09-3CB is a Thermal - Heat Sinks, Buffer Amps, Designed and produced by CTS Thermal Management Products. The BDN09-3CB produced by CTS Thermal Management Products can be purchased on the website of Dyethin. Here you can find various types of electronic parts from leading manufacturers worldwide. The BDN09-3CB of Dyethin has undergone strict quality control and meets all the requirements. The inventory status marked on Dyethin is for reference only. If you haven’t found the part you are looking for, you can contact us for more information, such as the inventory quantity of the BDN09-3CB Datasheet （PDF)， BDN09-3CB price, BDN09-3CB pinout, BDN09-3CB manual, and BDN09-3CB replacement Solution.

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Contains "BDN0" series products

BDN09-3CB/A01

HEATSINK CPU W/ADHESIVE .91"SQ