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TS391SNL250

Soldering, Desoldering, Rework Products

Manufacturer No:: TS391SNL250

Manufacturer:: Chip Quik Inc.

Product Category:: Solder

Description:: THERMALLY STABLE SOLDER PASTE NO

RoHs Status:: Lead Free / RoHS Compliant

Datasheet:: TS391SNL250 Datasheet(PDF)

Product Category :	Solder	Manufacturer :	Chip Quik Inc.
Composition :	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	Diameter :	-
Flux Type :	No-Clean	Form :	Jar, 8.8 oz (250g)
Melting Point :	423 ~ 428°F (217 ~ 220°C)	Part Status :	Active
Process :	Lead Free	Series :	-
Shelf Life :	12 Months (Date of Manufacture)	Type :	Solder Paste
Wire Gauge :	-

TS391SNL250 has the following characteristics

TS391SNL250is produced byChip Quik Inc., belongs to Solder, which belongs to the - series.

TS391SNL250 Product Detail:

TS391SNL250 is a Solder, Buffer Amps, Designed and produced by Chip Quik Inc.. The TS391SNL250 produced by Chip Quik Inc. can be purchased on the website of Dyethin. Here you can find various types of electronic parts from leading manufacturers worldwide. The TS391SNL250 of Dyethin has undergone strict quality control and meets all the requirements. The inventory status marked on Dyethin is for reference only. If you haven’t found the part you are looking for, you can contact us for more information, such as the inventory quantity of the TS391SNL250 Datasheet （PDF)， TS391SNL250 price, TS391SNL250 pinout, TS391SNL250 manual, and TS391SNL250 replacement Solution.