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| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI | DCON,15P,SNPB | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.025" (0.64mm) | 1.740" (44.20mm) | 0.690" (17.53mm) | Lead, Tin | 299.21µin (7.60µm) | Slot | |||
