Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Operating Temperature Type Shape Height Length Width Plating Plating - Thickness Attachment Method
GLOBAL STOCKS
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651
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Leader Tech Inc. 0.067 X 0.19 NI 18--8-19PCI-NI-1 - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.080" (2.03mm) 18.000" (457.20mm) 0.190" (4.83mm) Nickel Flash Adhesive
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1,518
In-stock
Leader Tech Inc. .080"H X 394"W X 48"L--D SHAPED- - Active Polyurethane Foam, Nickel-Copper Polyester (NI/CU) -40°C ~ 70°C Fabric Over Foam D-Shape 0.080" (2.03mm) 4.00 (1.22m) 0.394" (10.01mm) - - -
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1,005
In-stock
Leader Tech Inc. .080"H X .160"W X 9"L--D SHAPED- - Active Polyurethane Foam, Nickel-Copper Polyester (NI/CU) -40°C ~ 70°C Fabric Over Foam D-Shape 0.080" (2.03mm) 9.000" (228.60mm) 0.160" (4.06mm) - - -
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1,204
In-stock
Laird Technologies EMI NOSG,STR,NIB,USFT,PSA Slot Mount Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 0.262" (6.67mm) 0.450" (11.43mm) Nickel 299.21µin (7.60µm) Adhesive
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2,545
In-stock
Laird Technologies EMI NOSG,STR,SNB,USFT,PSA Slot Mount Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 0.262" (6.67mm) 0.450" (11.43mm) Tin 299.21µin (7.60µm) Adhesive
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1,374
In-stock
Laird Technologies EMI NOSG,STR,ZNC,USFT,PSA Slot Mount Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 0.262" (6.67mm) 0.450" (11.43mm) Zinc + Clear Chromate 299.21µin (7.60µm) Adhesive
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2,321
In-stock
Laird Technologies EMI NOSG COIL BF PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Unplated - Adhesive
0097062002
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3,016
In-stock
Laird Technologies EMI FINGERSTOCK BECU 11.176X406.4MM - Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.440" (11.18mm) - - Clip
0097061902
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3,350
In-stock
Laird Technologies EMI FINGERSTOCK BECU 11.176X406.4MM - Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.440" (11.18mm) - - Clip
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1,542
In-stock
Laird Technologies EMI CLO,STRSNB,USFT Clip-On Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.440" (11.18mm) Tin 299.21µin (7.60µm) Clip
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1,422
In-stock
Laird Technologies EMI NOSG,STR,SNB,PSA - Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 0.262" (6.67mm) 0.450" (11.43mm) Tin 299.21µin (7.60µm) Adhesive
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RFQ
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1,502
In-stock
Laird Technologies EMI NOSG,STR,BF,USF,PSA Slot Mount Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 0.262" (6.67mm) 0.450" (11.43mm) - - Adhesive
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RFQ
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2,131
In-stock
Laird Technologies EMI CLO,STR,BF,USFT Clip-On Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.440" (11.18mm) - - Clip
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2,473
In-stock
Leader Tech Inc. .080"H X .200"W X 24"L--RECTANGU - Active Polyurethane Foam, Nickel-Copper Polyester (NI/CU) -40°C ~ 70°C Fabric Over Foam Rectangular 0.080" (2.03mm) 24.000" (609.60mm) 0.200" (5.08mm) - - -
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2,385
In-stock
Leader Tech Inc. .080"H X 394"W X 12"L--D SHAPED- - Active Polyurethane Foam, Nickel-Copper Polyester (NI/CU) -40°C ~ 70°C Fabric Over Foam D-Shape 0.080" (2.03mm) 12.000" (304.80mm) 0.394" (10.01mm) - - -
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1,430
In-stock
Leader Tech Inc. 0.08 X 0.45 BD 16--8-45LPAH-BD-1 - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.450" (11.43mm) Unplated - Adhesive
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655
In-stock
Leader Tech Inc. 0.09 X 0.92 BD 16--8-92RC-BD-16- - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.920" (23.37mm) Unplated - Adhesive
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716
In-stock
Laird Technologies EMI NOSG,STR,BF,USFT Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) - - -
0077004302
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1,353
In-stock
Laird Technologies EMI GASKET BECU ALLOY 11.43X406.4MM - Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.450" (11.43mm) - - Adhesive
0098054202
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2,883
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Laird Technologies EMI FINGERSTCK ULTRASFT 6.35X406.4MM Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) - - -
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1,964
In-stock
Laird Technologies EMI NOSG,STR,SNB,USF,PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Tin 299.21µin (7.60µm) Adhesive
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1,078
In-stock
Leader Tech Inc. 0.08 X 0.25 BD 400--FOLDED SERIE - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.080" (2.03mm) 33.33 (10.16m) 0.250" (6.35mm) Unplated - Adhesive
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2,619
In-stock
Laird Technologies EMI NOSG,STR,NIB,PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Nickel 299.21µin (7.60µm) Adhesive
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3,503
In-stock
Laird Technologies EMI NOSG,STR,SNB,PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Tin 299.21µin (7.60µm) Adhesive
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851
In-stock
Laird Technologies EMI NOSG,STR,ZNC,PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Zinc + Clear Chromate 299.21µin (7.60µm) Adhesive
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715
In-stock
Laird Technologies EMI NOSG COIL SNB PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 25.000 (7.62m) 0.250" (6.35mm) Tin 299.21µin (7.60µm) Adhesive
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3,090
In-stock
Laird Technologies EMI NOSG COIL NIB PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Nickel 299.21µin (7.60µm) Adhesive
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1,688
In-stock
Laird Technologies EMI NOSG COIL ZNY PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Zinc + Yellow Chromate 299.21µin (7.60µm) Adhesive
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3,642
In-stock
Laird Technologies EMI NOSG COIL BF USF PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Unplated - Adhesive
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1,085
In-stock
Leader Tech Inc. .080"H X .275"W X 48"L--RECTANGU - Active Polyurethane Foam, Nickel-Copper Polyester (NI/CU) -40°C ~ 70°C Fabric Over Foam Rectangular 0.080" (2.03mm) 4.00 (1.22m) 0.275" (6.99mm) - - -