- Applied Filters :
34 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||
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VIEW |
3,715
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,USFT,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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VIEW |
1,848
In-stock
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Laird Technologies EMI | NOSG COIL BF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Unplated | - | Adhesive | |||
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VIEW |
2,321
In-stock
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Laird Technologies EMI | NOSG COIL BF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Unplated | - | Adhesive | |||
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VIEW |
2,584
In-stock
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Laird Technologies EMI | NOSG COIL BF USF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Unplated | - | Adhesive | |||
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VIEW |
716
In-stock
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Laird Technologies EMI | NOSG,STR,BF,USFT | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | |||
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VIEW |
1,671
In-stock
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Laird Technologies EMI | NOSG COIL SNB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
|
VIEW |
3,014
In-stock
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Laird Technologies EMI | GASKET BECU 9.65X406.4MM | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | - | - | Adhesive | |||
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VIEW |
2,152
In-stock
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Laird Technologies EMI | NOSG,STR,NIB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Nickel | 299.21µin (7.60µm) | Adhesive | |||
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|
VIEW |
998
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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|
VIEW |
1,531
In-stock
|
Laird Technologies EMI | NOSG,STR,NIB,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Nickel | 299.21µin (7.60µm) | Adhesive | |||
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VIEW |
3,036
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
|
VIEW |
2,883
In-stock
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Laird Technologies EMI | FINGERSTCK ULTRASFT 6.35X406.4MM | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | |||
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|
VIEW |
698
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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|
VIEW |
1,964
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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VIEW |
2,905
In-stock
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Laird Technologies EMI | NOSG,STR,ZNC,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | |||
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VIEW |
3,191
In-stock
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Laird Technologies EMI | NOSG,STR,BF,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | - | 299.21µin (7.60µm) | Adhesive | |||
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VIEW |
2,619
In-stock
|
Laird Technologies EMI | NOSG,STR,NIB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Nickel | 299.21µin (7.60µm) | Adhesive | |||
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|
VIEW |
3,503
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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VIEW |
2,052
In-stock
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Laird Technologies EMI | NOSG,STR,BF,USFT,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | - | - | Adhesive | |||
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VIEW |
851
In-stock
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Laird Technologies EMI | NOSG,STR,ZNC,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | |||
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VIEW |
715
In-stock
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Laird Technologies EMI | NOSG COIL SNB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 25.000 (7.62m) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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VIEW |
3,090
In-stock
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Laird Technologies EMI | NOSG COIL NIB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Nickel | 299.21µin (7.60µm) | Adhesive | |||
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VIEW |
1,688
In-stock
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Laird Technologies EMI | NOSG COIL ZNY PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | |||
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VIEW |
1,746
In-stock
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Laird Technologies EMI | NOSG,STR,BF,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | - | - | Adhesive | |||
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VIEW |
2,807
In-stock
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Laird Technologies EMI | NOSG COIL BF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | - | - | Adhesive | |||
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VIEW |
3,642
In-stock
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Laird Technologies EMI | NOSG COIL BF USF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Unplated | - | Adhesive | |||
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VIEW |
3,213
In-stock
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Laird Technologies EMI | NOSG COIL SNB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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|
VIEW |
3,616
In-stock
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Laird Technologies EMI | NOSG,STR,BF | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | Adhesive | |||
|
VIEW |
3,579
In-stock
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Laird Technologies EMI | GASKET BECU 19.3X609.6MM | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | - | - | Adhesive | |||
|
VIEW |
2,964
In-stock
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Laird Technologies EMI | GASKET BECU ALLOY 13X406.4MM | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | - | - | Adhesive | |||
