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7 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||
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VIEW |
3,715
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,USFT,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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VIEW |
2,584
In-stock
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Laird Technologies EMI | NOSG COIL BF USF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Unplated | - | Adhesive | |||
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VIEW |
3,191
In-stock
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Laird Technologies EMI | NOSG,STR,BF,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | - | 299.21µin (7.60µm) | Adhesive | |||
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VIEW |
2,807
In-stock
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Laird Technologies EMI | NOSG COIL BF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | - | - | Adhesive | |||
|
VIEW |
3,579
In-stock
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Laird Technologies EMI | GASKET BECU 19.3X609.6MM | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | - | - | Adhesive | |||
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|
VIEW |
962
In-stock
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Laird Technologies EMI | NOSG,STR,NIB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Nickel | 299.21µin (7.60µm) | Adhesive | |||
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|
VIEW |
2,854
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
