Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Operating Temperature Type Height Length Width Plating Plating - Thickness Attachment Method
GLOBAL STOCKS
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1,261
In-stock
Leader Tech Inc. 0.14 X 0.38 SN 16--14-38AH-SN-16 - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.140" (3.56mm) 16.000" (406.40mm) 0.380" (9.65mm) Tin Flash Adhesive
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RFQ
1,023
In-stock
Leader Tech Inc. 0.11 X 0.375 SN 16--FOLDED SERIE - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.110" (2.79mm) 16.000" (406.40mm) 0.380" (9.65mm) Tin Flash Adhesive
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RFQ
3,036
In-stock
Laird Technologies EMI NOSG,STR,SNB,USF,PSA Foldover Active Beryllium Copper 121°C Fingerstock 0.120" (3.05mm) 16.000" (406.40mm) 0.380" (9.65mm) Tin 299.21µin (7.60µm) Adhesive
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RFQ
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RFQ
698
In-stock
Laird Technologies EMI NOSG,STR,SNB,PSA Foldover Active Beryllium Copper 121°C Fingerstock 0.120" (3.05mm) 16.000" (406.40mm) 0.380" (9.65mm) Tin 299.21µin (7.60µm) Adhesive
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RFQ
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RFQ
3,749
In-stock
Laird Technologies EMI CLO,STR,DLN,SNB - Active Beryllium Copper 121°C Fingerstock 0.270" (6.86mm) 16.000" (406.40mm) 0.380" (9.65mm) Tin 299.21µin (7.60µm) Clip
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RFQ
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RFQ
2,117
In-stock
Laird Technologies EMI CLO,STR,TLN,SNB - Active Beryllium Copper 121°C Fingerstock 0.270" (6.86mm) 16.000" (406.40mm) 0.380" (9.65mm) Tin 299.21µin (7.60µm) Clip
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RFQ
VIEW
RFQ
1,944
In-stock
Laird Technologies EMI CLO,STR,TLN,SNSAT - Active Beryllium Copper 121°C Fingerstock 0.270" (6.86mm) 16.000" (406.40mm) 0.380" (9.65mm) Tin 299.21µin (7.60µm) Clip
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RFQ
VIEW
RFQ
3,213
In-stock
Laird Technologies EMI NOSG COIL SNB PSA Foldover Active Beryllium Copper 121°C Fingerstock 0.120" (3.05mm) 16.000" (406.40mm) 0.380" (9.65mm) Tin 299.21µin (7.60µm) Adhesive
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RFQ
VIEW
RFQ
1,588
In-stock
Leader Tech Inc. 0.20 X 0.377 SN 16--20-38RBCT-SN - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.200" (5.08mm) 16.000" (406.40mm) 0.380" (9.65mm) Tin Flash Adhesive