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20 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||
|
VIEW |
1,848
In-stock
|
Laird Technologies EMI | NOSG COIL BF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Unplated | - | Adhesive | |||
|
VIEW |
3,014
In-stock
|
Laird Technologies EMI | GASKET BECU 9.65X406.4MM | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | - | - | Adhesive | |||
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|
VIEW |
1,531
In-stock
|
Laird Technologies EMI | NOSG,STR,NIB,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Nickel | 299.21µin (7.60µm) | Adhesive | |||
|
|
VIEW |
3,036
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
|
|
VIEW |
698
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
|
|
VIEW |
2,905
In-stock
|
Laird Technologies EMI | NOSG,STR,ZNC,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | |||
|
VIEW |
1,922
In-stock
|
Laird Technologies EMI | FINGERSTOCK BECU 9.65X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.270" (6.86mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | - | - | Clip | |||
|
VIEW |
1,770
In-stock
|
Laird Technologies EMI | FINGERSTOCK BECU 9.65X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.200" (5.08mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | - | - | Clip | |||
|
VIEW |
1,790
In-stock
|
Laird Technologies EMI | FINGERSTOCK BECU 9.65X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.270" (6.86mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | - | - | Clip | |||
|
|
VIEW |
1,746
In-stock
|
Laird Technologies EMI | NOSG,STR,BF,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | - | - | Adhesive | |||
|
|
VIEW |
3,980
In-stock
|
Laird Technologies EMI | CLO,STR,DLN,NIB | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.270" (6.86mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Nickel | 299.21µin (7.60µm) | Clip | |||
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|
VIEW |
3,749
In-stock
|
Laird Technologies EMI | CLO,STR,DLN,SNB | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.270" (6.86mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21µin (7.60µm) | Clip | |||
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|
VIEW |
3,095
In-stock
|
Laird Technologies EMI | CLO,STR,DLN,ZNC | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.270" (6.86mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Clip | |||
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|
VIEW |
2,117
In-stock
|
Laird Technologies EMI | CLO,STR,TLN,SNB | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.270" (6.86mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21µin (7.60µm) | Clip | |||
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|
VIEW |
3,903
In-stock
|
Laird Technologies EMI | CLO,STR,TLN,NID | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.270" (6.86mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Nickel | 299.21µin (7.60µm) | Clip | |||
|
|
VIEW |
1,944
In-stock
|
Laird Technologies EMI | CLO,STR,TLN,SNSAT | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.270" (6.86mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21µin (7.60µm) | Clip | |||
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|
VIEW |
3,213
In-stock
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Laird Technologies EMI | NOSG COIL SNB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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|
VIEW |
945
In-stock
|
Laird Technologies EMI | CLO,STR,DLN,BF,USF | Clip-On | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.200" (5.08mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | - | - | Clip | |||
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|
VIEW |
3,663
In-stock
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Laird Technologies EMI | CLO,STR,DLN,BF,USFT | Clip-On | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.200" (5.08mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | - | - | Clip | |||
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|
VIEW |
1,853
In-stock
|
Laird Technologies EMI | GASKET BECU 9.65X406.4MM | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Nickel | 299.21µin (7.60µm) | Adhesive | |||
