Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Operating Temperature Type Height Length Width Plating Plating - Thickness Attachment Method
GLOBAL STOCKS
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674
In-stock
Laird Technologies EMI TWT,STR,SNPB,PSA Twist Active Beryllium Copper 121°C Fingerstock 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Lead, Tin 299.21µin (7.60µm) Adhesive
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RFQ
3,629
In-stock
Laird Technologies EMI TWT,STR,SNPB,USFT,PSA - Active Beryllium Copper 121°C Fingerstock 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Lead, Tin 299.21µin (7.60µm) Adhesive
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RFQ
1,903
In-stock
Leader Tech Inc. 0.03 X 0.23 SNPB 24 NTP--3-23T-S - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Lead, Tin Flash Adhesive