Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Frequency Current - Supply Package / Case Supplier Device Package Voltage - Supply Gain Noise Figure P1dB RF Type Test Frequency
GLOBAL STOCKS
BGA777L7E6327XTSA1
RFQ
VIEW
RFQ
1,062
In-stock
Infineon Technologies IC AMP MMIC SGL-BAND LN TSLP7-1 - Obsolete Digi-Reel® 2.3GHz, 2.7GHz 10mA 6-XFDFN Exposed Pad TSLP-7-1 2.6 V ~ 3 V 16.8dB 1.2dB -11dBm UMTS 2.3GHz
BGA777L7E6327XTSA1
RFQ
VIEW
RFQ
3,117
In-stock
Infineon Technologies IC AMP MMIC SGL-BAND LN TSLP7-1 - Obsolete Cut Tape (CT) 2.3GHz, 2.7GHz 10mA 6-XFDFN Exposed Pad TSLP-7-1 2.6 V ~ 3 V 16.8dB 1.2dB -11dBm UMTS 2.3GHz
BGA777L7E6327XTSA1
RFQ
VIEW
RFQ
670
In-stock
Infineon Technologies IC AMP MMIC SGL-BAND LN TSLP7-1 - Obsolete Tape & Reel (TR) 2.3GHz, 2.7GHz 10mA 6-XFDFN Exposed Pad TSLP-7-1 2.6 V ~ 3 V 16.8dB 1.2dB -11dBm UMTS 2.3GHz
BGA777N7E6327XTSA1
RFQ
VIEW
RFQ
2,263
In-stock
Infineon Technologies IC AMP SI-MMIC - Active Digi-Reel® 2.3GHz ~ 2.7GHz 4.2mA 6-XFDFN Exposed Pad TSNP-7-1 2.6 V ~ 3 V 16dB 1.2dB - UMTS 2.3GHz ~ 2.7MHz
BGA777N7E6327XTSA1
RFQ
VIEW
RFQ
3,469
In-stock
Infineon Technologies IC AMP SI-MMIC - Active Cut Tape (CT) 2.3GHz ~ 2.7GHz 4.2mA 6-XFDFN Exposed Pad TSNP-7-1 2.6 V ~ 3 V 16dB 1.2dB - UMTS 2.3GHz ~ 2.7MHz
BGA777N7E6327XTSA1
RFQ
VIEW
RFQ
807
In-stock
Infineon Technologies IC AMP SI-MMIC - Active Tape & Reel (TR) 2.3GHz ~ 2.7GHz 4.2mA 6-XFDFN Exposed Pad TSNP-7-1 2.6 V ~ 3 V 16dB 1.2dB - UMTS 2.3GHz ~ 2.7MHz