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| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Mounting Type | Applications | Package / Case | Type | Supplier Device Package | |
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Maxim Integrated | IC TDM/PACKET CHIP 484-BGA | - | Active | Tray | Surface Mount | Data Transport | 484-BGA Exposed Pad | TDM (Time Division Multiplexing) | 484-HSBGA (23x23) | |||
