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| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Mounting Type | Applications | Package / Case | Type | Supplier Device Package | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||
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VIEW |
1,819
In-stock
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Maxim Integrated | IC TDM OVER PACKET 484HSBGA | - | Not For New Designs | Tray | Surface Mount | Data Transport | 484-BGA Exposed Pad | TDM (Time Division Multiplexing) | 484-HSBGA (23x23) | |||
|
VIEW |
1,634
In-stock
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Maxim Integrated | IC TDM/PACKET CHIP 484-BGA | - | Active | Tray | Surface Mount | Data Transport | 484-BGA Exposed Pad | TDM (Time Division Multiplexing) | 484-HSBGA (23x23) | |||
