- Operating Temperature :
- Mounting Type :
- Package / Case :
-
- 24-DIP Module (0.600", 15.24mm) (5)
- 28-CDIP (0.600", 15.24mm) (6)
- 28-CFlatPack (5)
- 28-DIP (0.600", 15.24mm) (2)
- 28-DIP Module (0.600", 15.24mm) (7)
- 28-SOIC (0.295", 7.50mm Width) (5)
- 32-CDIP (0.600", 15.24mm) Window (2)
- 32-CFlatpack (1)
- 32-CLCC (4)
- 32-DIP Module (0.600", 15.24mm) (2)
- 32-LCC (J-Lead) (7)
- 34-PowerCap™ Module (5)
- 36-DIP Module (0.600", 15.24mm) (2)
- 56-BCPGA (1)
- Voltage - Supply :
- Memory Format :
- Memory Interface :
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54 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Technology | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package | Voltage - Supply | Memory Type | Memory Size | Access Time | Clock Frequency | Memory Format | Write Cycle Time - Word, Page | Memory Interface | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
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VIEW |
2,080
In-stock
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Microchip Technology | IC EEPROM 256KBIT 150NS 28CDIP | - | Active | Tube | EEPROM | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | - | EEPROM | 3ms | Parallel | |||
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|
VIEW |
2,127
In-stock
|
Microchip Technology | IC EEPROM 256KBIT 150NS 28CDIP | - | Active | Tube | EEPROM | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
|
VIEW |
1,473
In-stock
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Maxim Integrated | IC NVSRAM 256KBIT 150NS 34PCM | - | Active | Tube | NVSRAM (Non-Volatile SRAM) | 0°C ~ 70°C (TA) | Surface Mount | 34-PowerCap™ Module | 34-PowerCap Module | 3 V ~ 3.6 V | Non-Volatile | 256Kb (32K x 8) | 150ns | - | NVSRAM | 150ns | Parallel | |||
|
VIEW |
2,513
In-stock
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Maxim Integrated | IC NVSRAM 16MBIT 150NS 36EDIP | - | Active | Tube | NVSRAM (Non-Volatile SRAM) | 0°C ~ 70°C (TA) | Through Hole | 36-DIP Module (0.600", 15.24mm) | 36-EDIP | 3 V ~ 3.6 V | Non-Volatile | 16Mb (2M x 8) | 150ns | - | NVSRAM | 150ns | Parallel | |||
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|
VIEW |
1,506
In-stock
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Microchip Technology | LEV B COMPLIANT | - | Active | Tube | EEPROM | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
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|
VIEW |
3,978
In-stock
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Microchip Technology | LEV B COMPLIANT | - | Active | Tube | EEPROM | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | - | EEPROM | 3ms | Parallel | |||
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|
VIEW |
1,005
In-stock
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Microchip Technology | LEV B COMPLIANT | - | Active | Tube | EEPROM | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
|
VIEW |
3,886
In-stock
|
Microchip Technology | IC EEPROM 1MBIT 150NS 32PLCC | - | Active | Tube | EEPROM | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
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|
VIEW |
3,726
In-stock
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Maxim Integrated | IC NVSRAM 4MBIT 150NS 34PCM | - | Active | Tube | NVSRAM (Non-Volatile SRAM) | 0°C ~ 70°C (TA) | Surface Mount | 34-PowerCap™ Module | 34-PowerCap Module | 3 V ~ 3.6 V | Non-Volatile | 4Mb (512K x 8) | 150ns | - | NVSRAM | 150ns | Parallel | |||
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|
VIEW |
3,593
In-stock
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Maxim Integrated | IC NVSRAM 1MBIT 150NS 34PCM | - | Active | Tube | NVSRAM (Non-Volatile SRAM) | 0°C ~ 70°C (TA) | Surface Mount | 34-PowerCap™ Module | 34-PowerCap Module | 3 V ~ 3.6 V | Non-Volatile | 1Mb (128K x 8) | 150ns | - | NVSRAM | 150ns | Parallel | |||
|
VIEW |
737
In-stock
|
Honeywell Microelectronics & Precision Sensors | IC EEPROM 256KBIT PARA/SPI 56PGA | - | Active | Tube | EEPROM | -55°C ~ 225°C (TA) | Through Hole | 56-BCPGA | 56-CPGA | 4.75 V ~ 5.25 V | Non-Volatile | 256Kb (32K x 8) | 150ns | 5MHz | EEPROM | 90ms | Parallel, SPI | |||
|
VIEW |
2,850
In-stock
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Microchip Technology | IC EEPROM 1MBIT 150NS 32CDIP | - | Active | Tube | EEPROM | -55°C ~ 125°C (TC) | Through Hole | 32-CDIP (0.600", 15.24mm) Window | 32-CDIP | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
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|
VIEW |
3,615
In-stock
|
Microchip Technology | IC EEPROM 256KBIT 150NS 28CDIP | - | Active | Tube | EEPROM | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
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|
VIEW |
3,854
In-stock
|
Microchip Technology | IC EEPROM 1MBIT 150NS 32CDIP | - | Active | Tube | EEPROM | -55°C ~ 125°C (TC) | Through Hole | 32-CDIP (0.600", 15.24mm) Window | 32-CDIP | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
|
VIEW |
3,263
In-stock
|
Microchip Technology | IC EEPROM 1MBIT 150NS 32FLATPACK | - | Active | Tube | EEPROM | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
|
VIEW |
1,674
In-stock
|
Microchip Technology | IC EEPROM 1MBIT 150NS 32CLCC | - | Active | Tube | EEPROM | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
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|
VIEW |
1,520
In-stock
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Microchip Technology | IC EEPROM 256KBIT 150NS 32PLCC | - | Active | Tube | EEPROM | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
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|
VIEW |
2,288
In-stock
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Microchip Technology | IC EEPROM 256KBIT 150NS 32PLCC | - | Active | Tube | EEPROM | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
|
VIEW |
840
In-stock
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Microchip Technology | IC EEPROM 256KBIT 150NS 28DIP | - | Active | Tube | EEPROM | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
|
VIEW |
2,072
In-stock
|
Microchip Technology | IC EEPROM 64KBIT 150NS 28SOIC | - | Active | Tube | EEPROM | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC | 4.5 V ~ 5.5 V | Non-Volatile | 64Kb (8K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
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|
VIEW |
1,439
In-stock
|
Microchip Technology | IC EEPROM 64KBIT 150NS 32PLCC | - | Active | Tube | EEPROM | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC | 4.5 V ~ 5.5 V | Non-Volatile | 64Kb (8K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
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|
VIEW |
3,317
In-stock
|
Microchip Technology | IC EEPROM 64KBIT 150NS 28DIP | - | Active | Tube | EEPROM | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP | 4.5 V ~ 5.5 V | Non-Volatile | 64Kb (8K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
|
VIEW |
3,540
In-stock
|
Maxim Integrated | IC NVSRAM 16KBIT 150NS 24EDIP | - | Active | Tube | NVSRAM (Non-Volatile SRAM) | -40°C ~ 85°C (TA) | Through Hole | 24-DIP Module (0.600", 15.24mm) | 24-EDIP | 4.75 V ~ 5.25 V | Non-Volatile | 16Kb (2K x 8) | 150ns | - | NVSRAM | 150ns | Parallel | |||
|
VIEW |
3,171
In-stock
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Microchip Technology | IC EEPROM 256KBIT 150NS 28FLATPK | - | Active | Tube | EEPROM | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
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|
VIEW |
3,805
In-stock
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Microchip Technology | IC EEPROM 256KBIT 150NS 28FLATPK | - | Active | Tube | EEPROM | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | - | EEPROM | 3ms | Parallel | |||
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|
VIEW |
1,437
In-stock
|
Microchip Technology | IC EEPROM 256KBIT 150NS 28FLATPK | - | Active | Tube | EEPROM | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
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|
VIEW |
930
In-stock
|
Microchip Technology | IC EEPROM 256KBIT 150NS 28FLATPK | - | Active | Tube | EEPROM | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
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|
VIEW |
998
In-stock
|
Microchip Technology | IC EEPROM 256KBIT 150NS 28FLATPK | - | Active | Tube | EEPROM | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
|
|
VIEW |
3,674
In-stock
|
Microchip Technology | IC EEPROM 256KBIT 150NS 32CLCC | - | Active | Tube | EEPROM | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | - | EEPROM | 3ms | Parallel | |||
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|
VIEW |
2,399
In-stock
|
Microchip Technology | IC EEPROM 256KBIT 150NS 32CLCC | - | Active | Tube | EEPROM | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | - | EEPROM | 10ms | Parallel | |||
