- Manufacture :
-
- ON Semiconductor (1)
- Texas Instruments (4)
- Cypress Semiconductor Corp (8)
- Exar Corporation (36)
- IDT, Integrated Device Technology Inc (25)
- Infineon Technologies (17)
- Inphi Corporation (15)
- IXYS Integrated Circuits Division (6)
- Microsemi Corporation (37)
- Silicon Labs (3)
- STMicroelectronics (1)
- NXP USA Inc. (11)
- Maxim Integrated (54)
- Series :
- Operating Temperature :
- Mounting Type :
- Package / Case :
-
- 100-BQFP (2)
- 100-LBGA (8)
- 100-LQFP (3)
- 1020-BGA (2)
- 1024-BGA (3)
- 1152-BGA (2)
- 1369-BGA (3)
- 14-DIP (0.300", 7.62mm) (1)
- 14-SOIC (0.154", 3.90mm Width) (4)
- 144-BBGA (5)
- 144-BGA, CSPBGA (1)
- 144-LBGA (2)
- 144-LQFP (2)
- 160-BGA (7)
- 160-BQFP (4)
- 20-DIP (0.300", 7.62mm) (1)
- 20-LCC (J-Lead) (2)
- 20-TSSOP (0.173", 4.40mm Width) (1)
- 208-BFQFP (3)
- 208-BGA (2)
- 208-LBGA (2)
- 225-BGA (2)
- 256-BGA (11)
- 272-BBGA (4)
- 28-LCC (J-Lead) (1)
- 30-Stik Module (1)
- 300-BBGA (9)
- 316-BGA (2)
- 32-LCC (J-Lead) (4)
- 323-BBGA, FCBGA (2)
- 324-LBGA (3)
- 349-BGA Exposed Pad (2)
- 388-BBGA (3)
- 40-DIP (0.600", 15.24mm) (2)
- 416-BGA (2)
- 420-BBGA (2)
- 44-LCC (J-Lead) (13)
- 44-LQFP (2)
- 44-QFP (1)
- 480-LBGA (1)
- 484-BGA (10)
- 64-LQFP (5)
- 64-QFP (1)
- 640-BGA Exposed Pad (1)
- 672-BGA (2)
- 68-LCC (J-Lead) (1)
- 80-LQFP (5)
- 868-BGA (8)
- Interface :
-
- 2-Wire (8)
- 4-Bit Nibble, SFI-4.1, XSBI (4)
- E1, HDLC, PPP, Serial, T1, TMA (1)
- GMII, SerDes, TBI (1)
- HDLC, ISDN, V.110, X.30 (1)
- HDLC, PPP, Serial, TMA (2)
- HDLC, PPP, SS7, TMA (2)
- HDLC, V.110, X.30 (1)
- IEEE 1149.1 (1)
- Interlaken (1)
- Interlaken, XAUI (7)
- ISDN (8)
- LIU (40)
- LVTTL (8)
- Parallel/Serial (34)
- PCM (1)
- S-Bus (1)
- Serial (3)
- SPI-3, SPI-4-2 (1)
- SPI-4.2 (1)
- Supplier Device Package :
-
- 100-QFP (14x20) (2)
- 100-TBGA (11x11) (8)
- 1020-FCBGA (33x33) (1)
- 1020-UPBGA (1)
- 1024-BGA (33x33) (3)
- 1152-UPBGA (2)
- 1369-BGA (37.5x37.5) (3)
- 14-PDIP (1)
- 14-SOIC (4)
- 144-BGA (13x13) (2)
- 144-CSBGA (17x17) (2)
- 144-PBGA (17x17) (4)
- 144-TQFP (20x20) (2)
- 160-PBGA (15x15) (7)
- 160-PQFP (28x28) (2)
- 20-DIP (1)
- 20-PLCC (9x9) (2)
- 20-TSSOP (1)
- 208-PBGA (17x17) (2)
- 208-PQFP (28x28) (3)
- 208-STBGA (17x17) (2)
- 225-BGA (19x19) (2)
- 256-BGA (27x27) (2)
- 256-PBGA (27x27) (7)
- 272-PBGA (27x27) (4)
- 28-PLCC (11.51x11.51) (1)
- 300-PBGA (27x27) (9)
- 32-PLCC (11.43x13.97) (4)
- 323-FCLBGA (2)
- 349-TE-PBGA-2 (27x27) (2)
- 388-BGA (35x35) (3)
- 40-PDIP (2)
- 416-PBGA (27x27) (2)
- 420-PBGA (2)
- 44-PLCC (16.59x16.59) (12)
- 44-TQFP (10x10) (2)
- 480-TBGA (37.5x37.5) (1)
- 484-BGA (23x23) (8)
- 484-STBGA (23x23) (2)
- 64-TQFP (14x14) (4)
- 640-TEPBGA (31x31) (1)
- 672-TEPBGA (27x27) (2)
- 68-PLCC (24.23x24.23) (1)
- 80-TQFP (14x14) (5)
- P-64-MQFP (1)
- P-LCC-44 (1)
- P-MQFP-160-1 (2)
- P-MQFP-44 (1)
- P-TQFP-100 (3)
- P-TQFP-64 (1)
- PG-LBGA-324-3 (3)
- Function :
-
- CODEC (4)
- EPON Optical Network Unit Chip (1)
- Front End (2)
- FSK Demodulator, Tone Decoder (5)
- Line Card Controller (1)
- Line Interface Unit (LIU) (34)
- Multichannel Network Interface Controller (MUNICH) (6)
- Network Controller (1)
- Optical Transport Processor (4)
- PBX Controller (1)
- PBX Controller with DSP (1)
- Second Generation Modular (2)
- Single-Chip IP-Phone Solution (3)
- Subscriber Line Interface Concept (SLIC) (2)
- Switch (1)
- Transceiver (9)
- Applied Filters :
218 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Interface | Supplier Device Package | Voltage - Supply | Function | Power (Watts) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||
|
VIEW |
2,965
In-stock
|
NXP USA Inc. | IC VOIP PROCESSOR 4CH 672BGA | Obsolete | Bulk | - | - | Surface Mount | 672-BGA | - | 672-TEPBGA (27x27) | - | - | - | ||||
|
|
VIEW |
2,714
In-stock
|
NXP USA Inc. | IC VOIP PROCESSOR 8CH 672BGA | Obsolete | Bulk | - | - | Surface Mount | 672-BGA | - | 672-TEPBGA (27x27) | - | - | - | ||||
|
|
VIEW |
1,797
In-stock
|
NXP USA Inc. | IC C1K 650MHZ VOIP 448BGA | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
2,894
In-stock
|
NXP USA Inc. | IC C1K 650MHZ VOIP 448BGA | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
3,278
In-stock
|
NXP USA Inc. | IC C1K 650MHZ VOIP 448BGA | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
3,420
In-stock
|
NXP USA Inc. | IC C1K 450MHZ VOIP 448BGA | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
2,435
In-stock
|
NXP USA Inc. | IC C1K 450MHZ VOIP 448BGA | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
3,793
In-stock
|
NXP USA Inc. | IC C1K 450MHZ VOIP 484MAPBGA | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
3,949
In-stock
|
NXP USA Inc. | IC C1K 533MHZ VOIP 448BGA | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
1,718
In-stock
|
NXP USA Inc. | IC C1K 650MHZ VOIP 484MAPBGA | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
VIEW |
3,538
In-stock
|
NXP USA Inc. | IC HDLC 40-CH 480-TBGA | - | Obsolete | Tray | - | 0°C ~ 85°C | Surface Mount | 480-LBGA | IEEE 1149.1 | 480-TBGA (37.5x37.5) | 3.15 V ~ 3.45 V | - | - | |||
|
|
VIEW |
1,356
In-stock
|
Microsemi Corporation | MODULE SONET/SDH | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
1,062
In-stock
|
Microsemi Corporation | MODULE SONET/SDH | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
809
In-stock
|
Microsemi Corporation | MODULE SONET/SDH | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
3,557
In-stock
|
Microsemi Corporation | 84/63 CHAN T1/E1 VT1.5/VT2 MAPPE | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
2,262
In-stock
|
Microsemi Corporation | TEMUX 336NG, PB FREE BUMP | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
2,016
In-stock
|
Microsemi Corporation | 33 LINK, 672 HDLC CHANNEL FRAME | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
833
In-stock
|
Microsemi Corporation | 32 LINK, 672 HDLC CHANNEL FRAME | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
986
In-stock
|
Microsemi Corporation | 20G VT/TU SWITCHING ELEMENT | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
2,365
In-stock
|
Microsemi Corporation | 155 MBIT/S ATM AND PACKET-OVER-S | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
1,863
In-stock
|
Microsemi Corporation | 96-PORT (240G) STS-1 CROSS-CONNE | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
2,990
In-stock
|
Microsemi Corporation | 96-PORT (240G) STS-1 CROSS-CONNE | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
2,696
In-stock
|
Microsemi Corporation | PM5376 TSE-NX160 | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
931
In-stock
|
Microsemi Corporation | 40G VT/TU SWITCHING ELEMENT | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
2,134
In-stock
|
Microsemi Corporation | 40G VT/TU SWITCHING ELEMENT | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
1,609
In-stock
|
Microsemi Corporation | HIGH CAPACITY SINGLE-CHIP ADD/DR | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
2,150
In-stock
|
Microsemi Corporation | SINGLE-CHIP SONET/SDH TRANSPORT | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
622
In-stock
|
Microsemi Corporation | SONET/SDH TRANSPORT FRAMER/AGGRE | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
1,719
In-stock
|
Microsemi Corporation | SONET/SDH TRANSPORT FRAMER/AGGRE | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
|
|
VIEW |
3,171
In-stock
|
Microsemi Corporation | SONET/SDH TRANSPORT FRAMER/AGGRE | Obsolete | - | - | - | - | - | - | - | - | - | - | ||||
