Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Package / Case Supplier Device Package Peripherals Primary Attributes Core Processor Speed Architecture Flash Size RAM Size Connectivity
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RFQ
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RFQ
2,521
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Xilinx Inc. IC FPGA Zynq®-7000 Active Tray 0°C ~ 100°C (TJ) 676-BBGA, FCBGA 676-FCBGA (27x27) DMA Kintex™-7 FPGA, 350K Logic Cells Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 1GHz MCU, FPGA - 256Kb CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z045-3FFG676E
RFQ
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RFQ
2,942
In-stock
Xilinx Inc. IC SOC CORTEX-A9 KINTEX7 676FBGA Zynq®-7000 Active Tray 0°C ~ 100°C (TJ) 676-BBGA, FCBGA 676-FCBGA (27x27) DMA Kintex™-7 FPGA, 350K Logic Cells Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 1GHz MCU, FPGA - 256Kb CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z045-3FBG676E
RFQ
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RFQ
2,672
In-stock
Xilinx Inc. IC SOC CORTEX-A9 KINTEX7 676FBGA Zynq®-7000 Active Tray 0°C ~ 100°C (TJ) 676-BBGA, FCBGA 676-FCBGA (27x27) DMA Kintex™-7 FPGA, 350K Logic Cells Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 1GHz MCU, FPGA - 256Kb CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z030-3FFG676E
RFQ
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RFQ
936
In-stock
Xilinx Inc. IC SOC CORTEX-A9 KINTEX7 676FBGA Zynq®-7000 Active Tray 0°C ~ 100°C (TJ) 676-BBGA, FCBGA 676-FCBGA (27x27) DMA Kintex™-7 FPGA, 125K Logic Cells Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 1GHz MCU, FPGA - 256Kb CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z030-3FBG676E
RFQ
VIEW
RFQ
2,128
In-stock
Xilinx Inc. IC SOC CORTEX-A9 KINTEX7 676FBGA Zynq®-7000 Active Tray 0°C ~ 100°C (TJ) 676-BBGA, FCBGA 676-FCBGA (27x27) DMA Kintex™-7 FPGA, 125K Logic Cells Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 1GHz MCU, FPGA - 256Kb CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG