- Series :
- Operating Temperature :
- Interface :
- Supplier Device Package :
- Voltage - Supply :
- Core Processor :
- Program Memory Type :
- Applied Filters :
56 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Applications | Package / Case | Interface | Supplier Device Package | Voltage - Supply | Core Processor | Number of I/O | RAM Size | Program Memory Type | Controller Series | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
|
VIEW |
3,351
In-stock
|
Infineon Technologies | SECURITY IC'S/AUTHENTICATION IC' | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Embedded Security Trusted Computing | 32-VFQFN Exposed Pad | LPC | PG-VQFN-32-13 | 3 V ~ 3.6 V | 16-Bit | 1 | - | - | - | ||||
|
|
VIEW |
807
In-stock
|
Infineon Technologies | SECURITY IC'S/AUTHENTICATION IC' | Active | Tape & Reel (TR) | -20°C ~ 85°C | Surface Mount | Embedded Security Trusted Computing | 32-VFQFN Exposed Pad | SPI | PG-VQFN-32-13 | 1.65 V ~ 3.6 V | 16-Bit | 1 | - | - | - | ||||
|
|
VIEW |
1,321
In-stock
|
Infineon Technologies | SECURITY IC'S/AUTHENTICATION IC' | Active | Tape & Reel (TR) | -20°C ~ 85°C | Surface Mount | Embedded Security Trusted Computing | 32-VFQFN Exposed Pad | SPI | PG-VQFN-32-13 | 1.65 V ~ 3.6 V | 16-Bit | 1 | - | - | - | ||||
|
VIEW |
3,021
In-stock
|
Microchip Technology | PRODSTD IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
2,639
In-stock
|
Microchip Technology | PRODFF IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
3,174
In-stock
|
Microchip Technology | PRODSTD COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
3,162
In-stock
|
Microchip Technology | PRODFF COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
3,929
In-stock
|
Microchip Technology | FF IND I2C TPM 4X4 32VQFN CEK | - | Active | Digi-Reel® | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
1,609
In-stock
|
Microchip Technology | FF IND I2C TPM 4X4 32VQFN CEK | - | Active | Cut Tape (CT) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
3,235
In-stock
|
Microchip Technology | FF IND I2C TPM 4X4 32VQFN CEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
3,511
In-stock
|
Microchip Technology | FF COM I2C TPM 4X4 32VQFN CEK | - | Active | Digi-Reel® | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
2,867
In-stock
|
Microchip Technology | FF COM I2C TPM 4X4 32VQFN CEK | - | Active | Cut Tape (CT) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
1,252
In-stock
|
Microchip Technology | FF COM I2C TPM 4X4 32VQFN CEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
3,290
In-stock
|
Microchip Technology | FF COM SPI TPM 4X4 32VQFN CEK | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
3,188
In-stock
|
Microchip Technology | PROD FF IND I2C TPM 4X4 32VQFN S | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
2,434
In-stock
|
Microchip Technology | PROD FF IND I2C TPM 4X4 32VQFN U | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
3,818
In-stock
|
Microchip Technology | PROD FF IND I2C TPM 4X4 32VQFN C | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
3,207
In-stock
|
Microchip Technology | PROD FF COM I2C TPM 4X4 32VQFN S | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
1,683
In-stock
|
Microchip Technology | PROD FF COM I2C TPM 4X4 32VQFN C | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
1,843
In-stock
|
Microchip Technology | FF IND I2C TPM 4X4 32VQFN SEK | - | Active | Digi-Reel® | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
1,523
In-stock
|
Microchip Technology | FF IND I2C TPM 4X4 32VQFN SEK | - | Active | Cut Tape (CT) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
3,574
In-stock
|
Microchip Technology | FF IND I2C TPM 4X4 32VQFN SEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
3,697
In-stock
|
Microchip Technology | FF IND I2C TPM 4X4 32VQFN UEK | - | Active | Digi-Reel® | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
1,098
In-stock
|
Microchip Technology | FF IND I2C TPM 4X4 32VQFN UEK | - | Active | Cut Tape (CT) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
1,078
In-stock
|
Microchip Technology | FF IND I2C TPM 4X4 32VQFN UEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
1,337
In-stock
|
Microchip Technology | FF COM I2C TPM 4X4 32VQFN SEK | - | Active | Digi-Reel® | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
741
In-stock
|
Microchip Technology | FF COM I2C TPM 4X4 32VQFN SEK | - | Active | Cut Tape (CT) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
1,872
In-stock
|
Microchip Technology | FF COM I2C TPM 4X4 32VQFN SEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
2,627
In-stock
|
Microchip Technology | FF COM I2C TPM 4X4 32VQFN UEK | - | Active | Cut Tape (CT) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
VIEW |
1,061
In-stock
|
Microchip Technology | FF COM I2C TPM 4X4 32VQFN UEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
