Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Package / Case Supplier Device Package Peripherals Speed Voltage - Supply (Vcc/Vdd) Number of I/O RAM Size Core Size Connectivity Program Memory Size Program Memory Type EEPROM Size Data Converters Oscillator Type
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MC9S12XEP100CVL
RFQ
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RFQ
3,209
In-stock
NXP USA Inc. IC MCU 16BIT 1MB FLASH 208MAPBGA HCS12X Active Tray -40°C ~ 85°C (TA) 208-BGA 208-MAPBGA (17x17) LVD, POR, PWM, WDT 50MHz 1.72 V ~ 5.5 V 152 64K x 8 16-Bit CAN, EBI/EMI, I²C, IrDA, SCI, SPI 1MB (1M x 8) Flash 4K x 8 A/D 32x12b External
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RFQ
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RFQ
999
In-stock
NXP USA Inc. 16-BIT MCU S12X CORE 1MB FLASH HCS12X Active Tray -40°C ~ 85°C (TA) 208-BGA 208-MAPBGA (17x17) LVD, POR, PWM, WDT 50MHz 1.72 V ~ 5.5 V 152 64K x 8 16-Bit CAN, EBI/EMI, I²C, IrDA, SCI, SPI 1MB (1M x 8) Flash 4K x 8 A/D 32x12b External
S912XEP100J5CVL
RFQ
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RFQ
1,247
In-stock
NXP USA Inc. IC MCU 16BIT 1MB FLASH 208MAPBGA HCS12X Active Tray -40°C ~ 85°C (TA) 208-BGA 208-MAPBGA (17x17) LVD, POR, PWM, WDT 50MHz 1.72 V ~ 5.5 V 152 64K x 8 16-Bit CAN, EBI/EMI, I²C, IrDA, SCI, SPI 1MB (1M x 8) Flash 4K x 8 A/D 32x12b External
MC9S12XEP100MVL
RFQ
VIEW
RFQ
3,473
In-stock
NXP USA Inc. IC MCU 16BIT 1MB FLASH 208MAPBGA HCS12X Active Tray -40°C ~ 125°C (TA) 208-BGA 208-MAPBGA (17x17) LVD, POR, PWM, WDT 50MHz 1.72 V ~ 5.5 V 152 64K x 8 16-Bit CAN, EBI/EMI, I²C, IrDA, SCI, SPI 1MB (1M x 8) Flash 4K x 8 A/D 32x12b External