Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Package / Case Supplier Device Package Peripherals Core Processor Speed Voltage - Supply (Vcc/Vdd) Number of I/O RAM Size Core Size Connectivity Program Memory Size Program Memory Type Data Converters Oscillator Type
GLOBAL STOCKS
LPC2220FET144/G,55
RFQ
VIEW
RFQ
3,457
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 144TFBGA LPC2200 Active Tray -40°C ~ 85°C (TA) 144-TFBGA 144-TFBGA (12x12) POR, PWM, WDT ARM7® 75MHz 1.65 V ~ 3.6 V 76 64K x 8 16/32-Bit EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART - ROMless A/D 8x10b Internal
DS80C411-FNY+
RFQ
VIEW
RFQ
1,415
In-stock
Maxim Integrated IC MCU 8BIT 64KB ROM 100LQFP 80C Obsolete Tray -40°C ~ 85°C (TA) 100-LQFP 100-LQFP (14x14) Power-Fail Reset, WDT 8051 75MHz 1.62 V ~ 3.6 V 64 64K x 8 8-Bit 1-Wire®, CAN, EBI/EMI, Ethernet, SIO, UART/USART 64KB (64K x 8) ROM - External
DS80C410-FNY+
RFQ
VIEW
RFQ
1,428
In-stock
Maxim Integrated IC MCU 8BIT 64KB ROM 100LQFP 80C Obsolete Tray -40°C ~ 85°C (TA) 100-LQFP 100-LQFP (14x14) Power-Fail Reset, WDT 8051 75MHz 1.62 V ~ 3.6 V 64 64K x 8 8-Bit 1-Wire®, CAN, EBI/EMI, Ethernet, SIO, UART/USART 64KB (64K x 8) ROM - External
LPC2220FET144/G,51
RFQ
VIEW
RFQ
981
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 144TFBGA LPC2200 Active Tape & Reel (TR) -40°C ~ 85°C (TA) 144-TFBGA 144-TFBGA (12x12) POR, PWM, WDT ARM7® 75MHz 1.65 V ~ 3.6 V 76 64K x 8 16/32-Bit EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART - ROMless A/D 8x10b Internal
LPC2220FBD144,551
RFQ
VIEW
RFQ
3,561
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 144LQFP LPC2200 Active Tray -40°C ~ 85°C (TA) 144-LQFP 144-LQFP (20x20) POR, PWM, WDT ARM7® 75MHz 1.65 V ~ 3.6 V 76 64K x 8 16/32-Bit EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART - ROMless A/D 8x10b Internal