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- Package / Case :
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5 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||||
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1,535
In-stock
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NXP USA Inc. | IC MCU 32BIT 6MB FLASH 516FBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 180MHz | 1.14 V ~ 1.32 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, SCI, SPI | 6MB (6M x 8) | Flash | - | A/D 64x12b | Internal | |||
|
VIEW |
2,536
In-stock
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NXP USA Inc. | IC MCU 32BIT 6MB FLASH 416BGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 180MHz | 1.14 V ~ 1.32 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, SCI, SPI | 6MB (6M x 8) | Flash | - | A/D 64x12b | Internal | |||
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|
VIEW |
3,642
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 180MHz | 1.14 V ~ 1.32 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, SCI, SPI | 6MB (6M x 8) | Flash | - | A/D 64x12b | Internal | |||
|
VIEW |
1,522
In-stock
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Texas Instruments | IC MCU 32BIT 3MB FLASH 337NFBGA | Hercules™ TMS570 ARM® Cortex®-R | Active | Tray | -55°C ~ 125°C (TA) | 337-LFBGA | 337-NFBGA (16x16) | DMA, POR, PWM, WDT | ARM® Cortex®-R4F | 180MHz | 1.14 V ~ 1.32 V | 120 | 256K x 8 | 16/32-Bit | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, MibSPI, SCI, SPI, UART/USART | 3MB (3M x 8) | Flash | - | A/D 16x12b, 24x12b | External | |||
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|
VIEW |
1,262
In-stock
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Texas Instruments | IC MCU 32BIT 3MB FLASH 337NFBGA | Hercules™ TMS570 ARM® Cortex®-R | Active | Tube | -40°C ~ 125°C (TA) | 337-LFBGA | 337-NFBGA (16x16) | DMA, POR, PWM, WDT | ARM® Cortex®-R4F | 180MHz | 1.14 V ~ 1.32 V | 120 | 256K x 8 | 16/32-Bit | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, MibSPI, SCI, SPI, UART/USART | 3MB (3M x 8) | Flash | - | A/D 16x12b, 24x12b | External | |||
