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- Core Processor :
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7 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | Data Converters | Oscillator Type | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | |||||||||||||||||||||||||
VIEW |
2,136
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Obsolete | Tray | -20°C ~ 70°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA, WDT | Coldfire V2 | 140MHz | 1.08 V ~ 1.32 V | - | 128K x 8 | 32-Bit | CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG | - | ROMless | A/D 6x12b | External | ||||
VIEW |
1,176
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Obsolete | Tray | -40°C ~ 85°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA, WDT | Coldfire V2 | 140MHz | 1.08 V ~ 1.32 V | - | 128K x 8 | 32-Bit | CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG | - | ROMless | A/D 6x12b | External | ||||
VIEW |
2,597
In-stock
|
Microchip Technology | IC MCU 32BIT 256KB ROM 225LFBGA | CAP™ | Obsolete | Tray | -40°C ~ 85°C (TA) | 225-LFBGA | 225-LFBGA (13x13) | DMA, POR, PWM, WDT | ARM7® | 80MHz | 1.08 V ~ 3.6 V | 32 | 160K x 8 | 16/32-Bit | EBI/EMI, FPGA, IrDA, SPI, UART/USART, USB | 256KB (256K x 8) | ROM | A/D 8x10b | Internal | ||||
VIEW |
1,119
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Active | Tray | -20°C ~ 70°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA | Coldfire V2 | 140MHz | 1.08 V ~ 3.6 V | - | 128K x 8 | 32-Bit | ATA, Audio, CAN, EBI/EMI, I²C, IDE, SD, SPI, UART/USART, USB OTG | - | ROMless | A/D 6x12b | External | ||||
VIEW |
3,833
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA, WDT | Coldfire V2 | 140MHz | 1.08 V ~ 1.32 V | - | 128K x 8 | 32-Bit | CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG | - | ROMless | A/D 6x12b | External | ||||
VIEW |
1,376
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Not For New Designs | Tray | -20°C ~ 70°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA, WDT | Coldfire V2 | 140MHz | 1.08 V ~ 1.32 V | - | 128K x 8 | 32-Bit | CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG | - | ROMless | A/D 6x12b | External | ||||
VIEW |
3,435
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA | Coldfire V2 | 140MHz | 1.08 V ~ 3.6 V | - | 128K x 8 | 32-Bit | ATA, Audio, CAN, EBI/EMI, I²C, IDE, SD, SPI, UART/USART, USB OTG | - | ROMless | A/D 6x12b | External |