Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Package / Case Supplier Device Package Peripherals Core Processor Speed Voltage - Supply (Vcc/Vdd) Number of I/O RAM Size Core Size Connectivity Program Memory Size Program Memory Type EEPROM Size Data Converters Oscillator Type
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SPC5517GAMMG66
RFQ
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RFQ
3,316
In-stock
NXP USA Inc. IC MCU 32BIT 1.5MB FLASH 208BGA MPC55xx Qorivva Obsolete Tray -40°C ~ 125°C (TA) 208-BGA 208-MAPBGA (17x17) DMA, POR, PWM, WDT e200z0, e200z1 66MHz 4.5 V ~ 5.25 V 144 80K x 8 32-Bit Dual-Core CAN, EBI/EMI, I²C, SCI, SPI 1.5MB (1.5M x 8) Flash - A/D 40x12b Internal
SPC5517EAMMG66
RFQ
VIEW
RFQ
2,447
In-stock
NXP USA Inc. IC MCU 32BIT 1.5MB FLASH 208BGA MPC55xx Qorivva Obsolete Tray -40°C ~ 125°C (TA) 208-BGA 208-MAPBGA (17x17) DMA, POR, PWM, WDT e200z0, e200z1 66MHz 4.5 V ~ 5.25 V 144 80K x 8 32-Bit Dual-Core CAN, EBI/EMI, I²C, SCI, SPI 1.5MB (1.5M x 8) Flash - A/D 40x12b Internal
SPC5516EAMMG66
RFQ
VIEW
RFQ
2,448
In-stock
NXP USA Inc. IC MCU 32BIT 1MB FLASH 208MAPBGA MPC55xx Qorivva Obsolete Tray -40°C ~ 125°C (TA) 208-BGA 208-MAPBGA (17x17) DMA, POR, PWM, WDT e200z0, e200z1 66MHz 4.5 V ~ 5.25 V 144 64K x 8 32-Bit Dual-Core CAN, EBI/EMI, I²C, SCI, SPI 1MB (1M x 8) Flash - A/D 40x12b Internal
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RFQ
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RFQ
971
In-stock
NXP USA Inc. NXP 32-BIT MCU POWER ARCH 1.5M MPC55xx Qorivva Active Tray -40°C ~ 105°C (TA) 208-BGA 208-MAPBGA (17x17) DMA, POR, PWM, WDT e200z0, e200z1 66MHz 4.5 V ~ 5.25 V 111 80K x 8 32-Bit Dual-Core CAN, EBI/EMI, I²C, SCI, SPI 1.5MB (1.5M x 8) Flash - A/D 40x12b Internal