Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Package / Case Supplier Device Package Peripherals Core Processor Speed Voltage - Supply (Vcc/Vdd) Number of I/O RAM Size Core Size Connectivity Program Memory Size Program Memory Type Data Converters Oscillator Type
GLOBAL STOCKS
LPC2290FBD144,551
RFQ
VIEW
RFQ
2,369
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 144LQFP LPC2200 Obsolete Tray -40°C ~ 85°C (TA) 144-LQFP 144-LQFP (20x20) PWM, WDT ARM7® 60MHz 1.65 V ~ 3.6 V 76 16K x 8 16/32-Bit CAN, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART - ROMless A/D 8x10b Internal
LPC2210FBD144,551
RFQ
VIEW
RFQ
840
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 144LQFP LPC2200 Obsolete Tray -40°C ~ 85°C (TA) 144-LQFP 144-LQFP (20x20) POR, PWM, WDT ARM7® 60MHz 1.65 V ~ 3.6 V 76 16K x 8 16/32-Bit EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART - ROMless A/D 8x10b Internal
LPC2880FET180,551
RFQ
VIEW
RFQ
1,919
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 180TFBGA LPC2800 Obsolete Tray -40°C ~ 85°C (TA) 180-TFBGA 180-TFBGA (12x12) DMA, I²S, LCD, WDT ARM7® 60MHz 1.7 V ~ 3.6 V 85 64K x 8 16/32-Bit EBI/EMI, I²C, IrDA, Memory Card, UART/USART, USB - ROMless A/D 5x10b External
LPC2290FBD144/01,5
RFQ
VIEW
RFQ
1,518
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 144LQFP LPC2200 Active Tray -40°C ~ 85°C (TA) 144-LQFP 144-LQFP (20x20) PWM, WDT ARM7® 60MHz 1.65 V ~ 3.6 V 76 64K x 8 16/32-Bit CAN, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART - ROMless A/D 8x10b Internal
LPC2210FBD144/01,5
RFQ
VIEW
RFQ
1,853
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 144LQFP LPC2200 Active Tray -40°C ~ 85°C (TA) 144-LQFP 144-LQFP (20x20) POR, PWM, WDT ARM7® 60MHz 1.65 V ~ 3.6 V 76 16K x 8 16/32-Bit EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART - ROMless A/D 8x10b Internal