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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Package / Case	Supplier Device Package	Peripherals	Core Processor	Speed	Voltage - Supply (Vcc/Vdd)	Number of I/O	RAM Size	Core Size	Connectivity	Program Memory Size	Program Memory Type	Data Converters	Oscillator Type
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	LPC2460FET208,551	RFQ VIEW	PDF RFQ	1,668 In-stock	NXP USA Inc.	IC MCU 32BIT ROMLESS 208TFBGA		LPC2400	Active	Tray	-40°C ~ 85°C (TA)	208-TFBGA	208-TFBGA (15x15)	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	ARM7®	72MHz	3 V ~ 3.6 V	160	96K x 8	16/32-Bit	CAN, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG	-	ROMless	A/D 8x10b; D/A 1x10b	Internal
	LPC2460FBD208,551	RFQ VIEW	PDF RFQ	3,746 In-stock	NXP USA Inc.	IC MCU 32BIT ROMLESS 208LQFP		LPC2400	Active	Tray	-40°C ~ 85°C (TA)	208-LQFP	208-LQFP (28x28)	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	ARM7®	72MHz	3 V ~ 3.6 V	160	96K x 8	16/32-Bit	CAN, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG	-	ROMless	A/D 8x10b; D/A 1x10b	Internal
	LPC2470FBD208,551	RFQ VIEW	PDF RFQ	732 In-stock	NXP USA Inc.	IC MCU 32BIT ROMLESS 208LQFP		LPC2400	Active	Tray	-40°C ~ 85°C (TA)	208-LQFP	208-LQFP (28x28)	Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT	ARM7®	72MHz	3 V ~ 3.6 V	160	98K x 8	16/32-Bit	CAN, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG	-	ROMless	A/D 8x10b; D/A 1x10b	Internal
	LPC2470FET208,551	RFQ VIEW	PDF RFQ	1,038 In-stock	NXP USA Inc.	IC MCU 32BIT ROMLESS 208TFBGA		LPC2400	Active	Tray	-40°C ~ 85°C (TA)	208-TFBGA	208-TFBGA (15x15)	Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT	ARM7®	72MHz	3 V ~ 3.6 V	160	98K x 8	16/32-Bit	CAN, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG	-	ROMless	A/D 8x10b; D/A 1x10b	Internal

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