Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Package / Case Supplier Device Package Peripherals Core Processor Speed Voltage - Supply (Vcc/Vdd) Number of I/O RAM Size Core Size Connectivity Program Memory Size Program Memory Type EEPROM Size Data Converters Oscillator Type
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RFQ
3,703
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NXP USA Inc. 32 BITDUAL CORE4M FLAS MPC57xx Active Tray -40°C ~ 125°C (TA) 324-LFBGA 324-MAPBGA (19x19) DMA, LVD, POR, WDT e200z2, e200z4 80MHz/160MHz 3 V ~ 5.5 V 246 512K x 8 32-Bit Dual-Core CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG 4MB (4M x 8) Flash - A/D 80x10b, 64x12b Internal
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2,098
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NXP USA Inc. 32 BITDUAL CORE4M FLAS MPC57xx Active Tray -40°C ~ 105°C (TA) 324-LFBGA 324-MAPBGA (19x19) DMA, LVD, POR, WDT e200z2, e200z4 80MHz/160MHz 3 V ~ 5.5 V 246 512K x 8 32-Bit Dual-Core CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG 4MB (4M x 8) Flash - A/D 80x10b, 64x12b Internal
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RFQ
940
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NXP USA Inc. 32 BITDUAL CORE4M FLAS MPC57xx Active Tape & Reel (TR) -40°C ~ 105°C (TA) 324-LFBGA 324-MAPBGA (19x19) DMA, LVD, POR, WDT e200z2, e200z4 80MHz/160MHz 3 V ~ 5.5 V 246 512K x 8 32-Bit Dual-Core CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG 4MB (4M x 8) Flash - A/D 80x10b, 64x12b Internal