- Manufacture :
- Part Status :
- Operating Temperature :
- Peripherals :
- Speed :
- Voltage - Supply (Vcc/Vdd) :
- Program Memory Size :
- EEPROM Size :
- Data Converters :
- Applied Filters :
105 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||||
|
VIEW |
2,639
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 40x12b | Internal | |||
|
|
VIEW |
1,774
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 40x12b | Internal | |||
|
|
VIEW |
3,848
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | Internal | |||
|
|
VIEW |
817
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 80MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 40x12b | Internal | |||
|
VIEW |
1,635
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | Internal | |||
|
|
VIEW |
1,587
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 40x12b | Internal | |||
|
|
VIEW |
1,848
In-stock
|
NXP USA Inc. | SINGLE CORE 1.5M FLASH 192K RA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
|
|
VIEW |
2,746
In-stock
|
NXP USA Inc. | SINGLE CORE 1.5M FLASH 192K RA | MPC57xx | Active | - | -40°C ~ 125°C (TA) | - | - | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
|
|
VIEW |
2,910
In-stock
|
NXP USA Inc. | 32 BIT,2M FLASH,120MHZ | MPC57xx | Active | Tray | -40°C ~ 85°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
|
|
VIEW |
3,755
In-stock
|
NXP USA Inc. | SINGLE CORE 2M FLASH 256K RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
|
|
VIEW |
1,811
In-stock
|
NXP USA Inc. | SINGLE CORE, 1.5M FLASH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
|
|
VIEW |
2,778
In-stock
|
NXP USA Inc. | 32 BIT SINGLE CORE 2M FLASH 256K | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
|
|
VIEW |
1,820
In-stock
|
NXP USA Inc. | 32 BIT SINGLE CORE 2M FLASH 256K | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
|
|
VIEW |
2,489
In-stock
|
NXP USA Inc. | SINGLE CORE 2M FLASH 256K RAM | MPC57xx | Active | - | -40°C ~ 105°C (TA) | - | - | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
|
|
VIEW |
1,427
In-stock
|
NXP USA Inc. | 32 BIT,2M FLASH,256K RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
|
|
VIEW |
849
In-stock
|
NXP USA Inc. | SINGLE CORE 1.5M FLASH 192K RA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
|
|
VIEW |
1,582
In-stock
|
NXP USA Inc. | SINGLE CORE, 3M FLASH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
|
|
VIEW |
1,427
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 5.25 V | 84 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | Internal | |||
|
|
VIEW |
3,464
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 5.25 V | 84 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | Internal | |||
|
|
VIEW |
3,761
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 5.25 V | 84 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | Internal | |||
|
|
VIEW |
1,365
In-stock
|
NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 3 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
|
|
VIEW |
1,749
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4 | 80MHz | 1.14 V ~ 5.25 V | 84 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | Internal | |||
|
|
VIEW |
1,163
In-stock
|
NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
|
|
VIEW |
3,784
In-stock
|
NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
|
VIEW |
2,551
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL CORE 3MB FLA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
|
|
VIEW |
3,592
In-stock
|
NXP USA Inc. | SINGLE CORE, 1.5M FLASH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
|
|
VIEW |
3,975
In-stock
|
NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
|
|
VIEW |
2,606
In-stock
|
NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | - | -40°C ~ 125°C (TA) | - | - | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
|
|
VIEW |
1,470
In-stock
|
NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
|
|
VIEW |
1,535
In-stock
|
NXP USA Inc. | 32 BIT SINGLE CORE 1.5M FLASH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
