Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Package / Case Supplier Device Package Peripherals Core Processor Speed Voltage - Supply (Vcc/Vdd) Number of I/O RAM Size Core Size Connectivity Program Memory Size Program Memory Type Oscillator Type
GLOBAL STOCKS
MCF5329CVM240J
RFQ
VIEW
RFQ
2,200
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 256MAPBGA MCF532x Obsolete Tray -40°C ~ 85°C (TA) 256-LBGA 256-MAPBGA DMA, LCD, PWM, WDT Coldfire V3 240MHz 1.4 V ~ 3.6 V 94 32K x 8 32-Bit CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG - ROMless External
MCF53281CVM240J
RFQ
VIEW
RFQ
1,932
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 256MAPBGA MCF532x Obsolete Tray -40°C ~ 85°C (TA) 256-LBGA 256-MAPBGA DMA, LCD, PWM, WDT Coldfire V3 240MHz 1.4 V ~ 3.6 V 94 32K x 8 32-Bit CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG - ROMless External
MCF53281CVM240
RFQ
VIEW
RFQ
2,101
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 256MAPBGA MCF532x Not For New Designs Tray -40°C ~ 85°C (TA) 256-LBGA 256-MAPBGA DMA, LCD, PWM, WDT Coldfire V3 240MHz 1.4 V ~ 3.6 V 94 32K x 8 32-Bit CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG - ROMless External
MCF5329CVM240
RFQ
VIEW
RFQ
1,034
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 256MAPBGA MCF532x Not For New Designs Tray -40°C ~ 85°C (TA) 256-LBGA 256-MAPBGA DMA, LCD, PWM, WDT Coldfire V3 240MHz 1.4 V ~ 3.6 V 94 32K x 8 32-Bit CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG - ROMless External