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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Operating Temperature	Mounting Type	Package / Case	Supplier Device Package	Voltage - Supply	Number of Gates	Number of I/O	Number of LABs/CLBs	Number of Logic Elements/Cells	Total RAM Bits
GLOBAL STOCKS
	XC4062XL-3BG560I	RFQ VIEW	PDF RFQ	3,897 In-stock	Xilinx Inc.	IC FPGA 384 I/O 560MBGA		XC4000E/X	Obsolete	-40°C ~ 100°C (TJ)	Surface Mount	560-LBGA Exposed Pad, Metal	560-MBGA (42.5x42.5)	3 V ~ 3.6 V	62000	384	2304	5472	73728
	XC4062XL-3BG560C	RFQ VIEW	PDF RFQ	872 In-stock	Xilinx Inc.	IC FPGA 384 I/O 560MBGA		XC4000E/X	Obsolete	0°C ~ 85°C (TJ)	Surface Mount	560-LBGA Exposed Pad, Metal	560-MBGA (42.5x42.5)	3 V ~ 3.6 V	62000	384	2304	5472	73728
	XC4062XL-2BG560I	RFQ VIEW	PDF RFQ	3,112 In-stock	Xilinx Inc.	IC FPGA 384 I/O 560MBGA		XC4000E/X	Obsolete	-40°C ~ 100°C (TJ)	Surface Mount	560-LBGA Exposed Pad, Metal	560-MBGA (42.5x42.5)	3 V ~ 3.6 V	62000	384	2304	5472	73728
	XC4062XL-2BG560C	RFQ VIEW	PDF RFQ	1,088 In-stock	Xilinx Inc.	IC FPGA 384 I/O 560MBGA		XC4000E/X	Obsolete	0°C ~ 85°C (TJ)	Surface Mount	560-LBGA Exposed Pad, Metal	560-MBGA (42.5x42.5)	3 V ~ 3.6 V	62000	384	2304	5472	73728
	XC4062XL-1BG560I	RFQ VIEW	PDF RFQ	3,094 In-stock	Xilinx Inc.	IC FPGA 384 I/O 560MBGA		XC4000E/X	Obsolete	-40°C ~ 100°C (TJ)	Surface Mount	560-LBGA Exposed Pad, Metal	560-MBGA (42.5x42.5)	3 V ~ 3.6 V	62000	384	2304	5472	73728
	XC4062XL-1BG560C	RFQ VIEW	PDF RFQ	1,501 In-stock	Xilinx Inc.	IC FPGA 384 I/O 560MBGA		XC4000E/X	Obsolete	0°C ~ 85°C (TJ)	Surface Mount	560-LBGA Exposed Pad, Metal	560-MBGA (42.5x42.5)	3 V ~ 3.6 V	62000	384	2304	5472	73728
	XC4062XL-09BG560C	RFQ VIEW	PDF RFQ	1,188 In-stock	Xilinx Inc.	IC FPGA 384 I/O 560MBGA		XC4000E/X	Obsolete	0°C ~ 85°C (TJ)	Surface Mount	560-LBGA Exposed Pad, Metal	560-MBGA (42.5x42.5)	3 V ~ 3.6 V	62000	384	2304	5472	73728

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