Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Package / Case Type Interface Supplier Device Package Clock Rate Non-Volatile Memory On-Chip RAM Voltage - I/O Voltage - Core
GLOBAL STOCKS
ADSP-BF705BBCZ-3
RFQ
VIEW
RFQ
1,595
In-stock
Analog Devices Inc. IC DSP LP 512KB L2SR 184BGA Blackfin® Active Tray -40°C ~ 85°C (TA) Surface Mount 184-LFBGA, CSPBGA Blackfin+ CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG 184-CSPBGA (12x12) 300MHz ROM (512 kB) 512kb 1.8V, 3.3V 1.10V
ADSP-BF705KBCZ-3
RFQ
VIEW
RFQ
872
In-stock
Analog Devices Inc. IC DSP LP 512KB L2SR 184BGA Blackfin® Active Tray 0°C ~ 70°C (TA) Surface Mount 184-LFBGA, CSPBGA Blackfin+ CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG 184-CSPBGA (12x12) 300MHz ROM (512 kB) 512kb 1.8V, 3.3V 1.10V
ADSP-BF704BCPZ-3
RFQ
VIEW
RFQ
3,956
In-stock
Analog Devices Inc. IC DSP LP 512KB L2SR 88LFCSP Blackfin® Active Tray -40°C ~ 85°C (TA) Surface Mount 88-VFQFN Exposed Pad, CSP Blackfin+ CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG 88-LFCSP-VQ (12x12) 300MHz ROM (512 kB) 512kb 1.8V, 3.3V 1.10V
ADBF705WCBCZ311
RFQ
VIEW
RFQ
3,978
In-stock
Analog Devices Inc. BLK+PROCW/512KB L2 SRAM,DDR2 Automotive Active Tray -40°C ~ 105°C (TA) Surface Mount 184-LFBGA, CSPBGA Blackfin+ CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG 184-CSPBGA (12x12) 300MHz ROM (512 kB) 512kb 1.8V, 3.3V 1.10V
MSC8103M1200F
RFQ
VIEW
RFQ
3,199
In-stock
NXP USA Inc. DSP 16BIT 300MHZ CPM 332FCBGA StarCore Obsolete Tray -40°C ~ 75°C (TJ) Surface Mount 332-BFBGA, FCPBGA SC140 Core Communications Processor Module (CPM) 332-FCBGA (17x17) 300MHz External 512kb 3.30V 1.60V
MSC8101M1500F
RFQ
VIEW
RFQ
3,336
In-stock
NXP USA Inc. DSP 16BIT 300MHZ CPM 332FCBGA StarCore Obsolete Tray -40°C ~ 75°C (TJ) Surface Mount 332-BFBGA, FCPBGA SC140 Core Communications Processor Module (CPM) 332-FCBGA (17x17) 300MHz External 512kb 3.30V 1.60V
MSC8103VT1200F
RFQ
VIEW
RFQ
697
In-stock
NXP USA Inc. IC DSP 16BIT 300MHZ 332FCBGA StarCore Obsolete Tray -40°C ~ 75°C (TJ) Surface Mount 332-BFBGA, FCPBGA SC140 Core Communications Processor Module (CPM) 332-FCBGA (17x17) 300MHz External 512kb 3.30V 1.60V
MSC8101VT1500F
RFQ
VIEW
RFQ
2,466
In-stock
NXP USA Inc. IC DSP 16BIT 250MHZ 332FCBGA StarCore Obsolete Tray -40°C ~ 75°C (TJ) Surface Mount 332-BFBGA, FCPBGA SC140 Core Communications Processor Module (CPM) 332-FCBGA (17x17) 300MHz External 512kb 3.30V 1.60V
ADSP-BF704KCPZ-3
RFQ
VIEW
RFQ
729
In-stock
Analog Devices Inc. IC DSP LP 512KB L2SR 88LFCSP Blackfin® Active Tray 0°C ~ 70°C (TA) Surface Mount 88-VFQFN Exposed Pad, CSP Blackfin+ CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG 88-LFCSP-VQ (12x12) 300MHz ROM (512 kB) 512kb 1.8V, 3.3V 1.10V
ADBF704WCCPZ311
RFQ
VIEW
RFQ
1,635
In-stock
Analog Devices Inc. BLACKFIN+ PROCESSOR W/ 512KB L2 Automotive Active Tray -40°C ~ 105°C (TA) Surface Mount 88-VFQFN Exposed Pad, CSP Blackfin+ CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG 88-LFCSP-VQ (12x12) 300MHz ROM (512 kB) 512kb 1.8V, 3.3V 1.10V