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| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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CTS Thermal Management Products | HEATSINK CPU W/ADHESIVE 1.21"SQ | BDN | Active | Aluminum | Top Mount | Square, Pin Fins | 1.210" (30.73mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.555" (14.10mm) | 5.20°C/W @ 400 LFM | 16.50°C/W | Black Anodized | |||
