Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Diameter Package Cooled Attachment Method Height Off Base (Height of Fin) Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
GLOBAL STOCKS
BDN15-3CB/A01
RFQ
VIEW
RFQ
3,824
In-stock
CTS Thermal Management Products HEATSINK CPU W/ADHESIVE 1.51"SQ BDN Active Aluminum Top Mount Square, Pin Fins 1.510" (38.35mm) - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) 0.355" (9.02mm) 4.50°C/W @ 400 LFM 15.10°C/W Black Anodized
BDN16-3CB/A01
RFQ
VIEW
RFQ
740
In-stock
CTS Thermal Management Products HEATSINK CPU W/ADHESIVE 1.61"SQ BDN Active Aluminum Top Mount Square, Pin Fins 1.610" (40.89mm) - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) 0.355" (9.02mm) 4.50°C/W @ 400 LFM 13.50°C/W Black Anodized