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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Material	Type	Shape	Length	Width	Package Cooled	Attachment Method	Height Off Base (Height of Fin)	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material Finish
GLOBAL STOCKS
	658-60ABT4	RFQ VIEW	PDF RFQ	3,815 In-stock	Wakefield-Vette	HEATSINK CPU 27.9MM SQ W/ADH BLK		658	Obsolete	Aluminum	Top Mount	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	BGA	Thermal Tape, Adhesive (Included)	0.598" (15.20mm)	2.5W @ 30°C	2.00°C/W @ 500 LFM	-	Black Anodized
	658-60ABT2	RFQ VIEW	PDF RFQ	2,606 In-stock	Wakefield-Vette	HEATSINK CPU 28MM SQ BLK W/TAPE		658	Obsolete	Aluminum	Top Mount	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	BGA	Thermal Tape, Adhesive (Included)	0.598" (15.20mm)	2.5W @ 30°C	2.00°C/W @ 500 LFM	-	Black Anodized
	658-60ABT1	RFQ VIEW	PDF RFQ	976 In-stock	Wakefield-Vette	HEATSINK CPU 28MM SQ BLK W/TAPE		658	Obsolete	Aluminum	Top Mount	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	BGA	Thermal Tape, Adhesive (Included)	0.598" (15.20mm)	2.5W @ 30°C	2.00°C/W @ 500 LFM	-	Black Anodized
	500503B00000G	RFQ VIEW	PDF RFQ	2,125 In-stock	Aavid, Thermal Division of Boyd Corporation	HEATSINK TO-3 14W H=0.82" BLK		-	Active	Aluminum	Board Level	Square, Pin Fins	2.500" (63.50mm)	2.500" (63.50mm)	TO-3	Bolt On	0.821" (20.86mm)	6.0W @ 40°C	2.00°C/W @ 500 LFM	4.90°C/W	Black Anodized
	501503B00000G	RFQ VIEW	PDF RFQ	1,853 In-stock	Aavid, Thermal Division of Boyd Corporation	HEATSINK TO-3 1.00" BLK		-	Active	Aluminum	Board Level	Rhombus	1.880" (47.75mm)	1.400" (35.56mm)	TO-3	Bolt On	1.000" (25.40mm)	5.0W @ 40°C	2.00°C/W @ 500 LFM	8.40°C/W	Black Anodized
	529802B00000	RFQ VIEW	PDF RFQ	1,146 In-stock	Aavid, Thermal Division of Boyd Corporation	HEATSINK TO-220 10W H=1.5" BLK		-	Active	Aluminum	Board Level, Vertical	Rectangular, Fins	1.500" (38.10mm)	1.650" (41.91mm)	TO-220	Bolt On	1.000" (25.40mm)	8.0W @ 40°C	2.00°C/W @ 500 LFM	-	Black Anodized
	658-60AB	RFQ VIEW	PDF RFQ	1,430 In-stock	Wakefield-Vette	HEATSINK CPU 28MM SQ BLK W/OTAPE		658	Active	Aluminum	Top Mount	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	BGA	Thermal Tape, Adhesive (Not Included)	0.598" (15.20mm)	2.5W @ 30°C	2.00°C/W @ 500 LFM	-	Black Anodized
	658-60ABT4E	RFQ VIEW	PDF RFQ	1,006 In-stock	Wakefield-Vette	HEATSINK CPU 27.9MM SQ W/ADH BLK		658	Active	Aluminum	Top Mount	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	BGA	Thermal Tape, Adhesive (Included)	0.598" (15.20mm)	2.5W @ 30°C	2.00°C/W @ 500 LFM	-	Black Anodized
	533402B02552G	RFQ VIEW	PDF RFQ	2,703 In-stock	Aavid, Thermal Division of Boyd Corporation	HEATSINK TO-220 SOLDERPIN/CLIP		-	Active	Aluminum	Board Level, Vertical	Rectangular, Fins	1.500" (38.10mm)	1.650" (41.91mm)	TO-220	Clip and PC Pin	1.000" (25.40mm)	8.0W @ 40°C	2.00°C/W @ 500 LFM	5.00°C/W	Black Anodized
	658-60ABT1E	RFQ VIEW	PDF RFQ	1,796 In-stock	Wakefield-Vette	HEATSINK CPU 28MM SQ BLK W/TAPE		658	Active	Aluminum	Top Mount	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	BGA	Thermal Tape, Adhesive (Included)	0.600" (15.24mm)	2.5W @ 30°C	2.00°C/W @ 500 LFM	-	Black Anodized
	658-60ABT3	RFQ VIEW	PDF RFQ	3,729 In-stock	Wakefield-Vette	HEATSINK CPU 28MM SQ BLK W/TAPE		658	Active	Aluminum	Top Mount	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	BGA	Thermal Tape, Adhesive (Included)	0.598" (15.20mm)	2.5W @ 30°C	2.00°C/W @ 500 LFM	-	Black Anodized
	529801B02500G	RFQ VIEW	PDF RFQ	1,762 In-stock	Aavid, Thermal Division of Boyd Corporation	HEATSINK TO-218 W/PINS 1.5"TALL		-	Active	Aluminum	Board Level, Vertical	Rectangular, Fins	1.500" (38.10mm)	1.650" (41.91mm)	TO-218	Bolt On and PC Pin	1.000" (25.40mm)	10.0W @ 50°C	2.00°C/W @ 500 LFM	5.00°C/W	Black Anodized

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