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5 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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GLOBAL STOCKS | ||||||||||||||||||||||
VIEW |
1,997
In-stock
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Comair Rotron | HEATSINK STAMP 24.1X48.3X49.5MM | - | Obsolete | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.950" (49.53mm) | 1.900" (48.26mm) | - | TO-220 | Bolt On and PC Pin | 0.950" (24.13mm) | 3.0W @ 20°C | 2.50°C/W @ 400 LFM | - | Black Anodized | ||||
VIEW |
3,320
In-stock
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Wakefield-Vette | HEATSINK CPU 43MM SQ BLK H=.65" | 628 | Active | Aluminum | Top Mount | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.650" (16.51mm) | 3.0W @ 20°C | 2.00°C/W @ 400 LFM | - | Black Anodized | ||||
VIEW |
2,423
In-stock
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Apex Microtechnology | HEATSINK 6P DIP | Apex Precision Power® | Active | Aluminum | Board Level | Square, Pin Fins | 2.500" (63.50mm) | 2.500" (63.50mm) | - | 6-DIP | Bolt On | 0.900" (22.86mm) | 3.0W @ 20°C | 30.00°C/W @ 500 LFM | 5.60°C/W | Black Anodized | ||||
VIEW |
3,888
In-stock
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK 1.95" TO220 | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.950" (49.53mm) | 1.900" (48.26mm) | - | TO-220 | Bolt On and PC Pin | 0.950" (24.13mm) | 3.0W @ 20°C | 2.50°C/W @ 400 LFM | 4.40°C/W | Black Anodized | ||||
VIEW |
1,575
In-stock
|
Wakefield-Vette | HEATSINK CPU 43MM SQ BLK H=.65" | 628 | Active | Aluminum | Top Mount | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Not Included) | 0.650" (16.51mm) | 3.0W @ 20°C | 2.00°C/W @ 400 LFM | - | Black Anodized |