Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Width Diameter Package Cooled Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
GLOBAL STOCKS
825802B05300
RFQ
VIEW
RFQ
1,997
In-stock
Comair Rotron HEATSINK STAMP 24.1X48.3X49.5MM - Obsolete Aluminum Board Level, Vertical Rectangular, Fins 1.950" (49.53mm) 1.900" (48.26mm) - TO-220 Bolt On and PC Pin 0.950" (24.13mm) 3.0W @ 20°C 2.50°C/W @ 400 LFM - Black Anodized
Default Photo
RFQ
VIEW
RFQ
3,320
In-stock
Wakefield-Vette HEATSINK CPU 43MM SQ BLK H=.65" 628 Active Aluminum Top Mount Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) 0.650" (16.51mm) 3.0W @ 20°C 2.00°C/W @ 400 LFM - Black Anodized
HS21
RFQ
VIEW
RFQ
2,423
In-stock
Apex Microtechnology HEATSINK 6P DIP Apex Precision Power® Active Aluminum Board Level Square, Pin Fins 2.500" (63.50mm) 2.500" (63.50mm) - 6-DIP Bolt On 0.900" (22.86mm) 3.0W @ 20°C 30.00°C/W @ 500 LFM 5.60°C/W Black Anodized
7023B-MTG
RFQ
VIEW
RFQ
3,888
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEATSINK 1.95" TO220 - Active Aluminum Board Level, Vertical Rectangular, Fins 1.950" (49.53mm) 1.900" (48.26mm) - TO-220 Bolt On and PC Pin 0.950" (24.13mm) 3.0W @ 20°C 2.50°C/W @ 400 LFM 4.40°C/W Black Anodized
628-65AB
RFQ
VIEW
RFQ
1,575
In-stock
Wakefield-Vette HEATSINK CPU 43MM SQ BLK H=.65" 628 Active Aluminum Top Mount Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) 0.650" (16.51mm) 3.0W @ 20°C 2.00°C/W @ 400 LFM - Black Anodized