- Manufacture :
- Material :
- Type :
- Package Cooled :
- Attachment Method :
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4 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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VIEW |
1,402
In-stock
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Assmann WSW Components | HEATSINK CPU XCUT | - | Active | Aluminum Alloy | Top Mount | Square, Pin Fins | 0.906" (23.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Not Included) | 0.236" (6.00mm) | - | 22.00°C/W | Black Anodized | ||||
VIEW |
1,567
In-stock
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Assmann WSW Components | HEATSINK ALUM ANOD | - | Active | Aluminum | Top Mount | Square, Pin Fins | 0.906" (23.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Clip and Board Mounts | 0.335" (8.50mm) | - | 18.00°C/W | Black Anodized | ||||
VIEW |
1,976
In-stock
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Wakefield-Vette | ANCHOR HEATSINK 23X23X16.5MM | Wave 2x | Active | Aluminum Alloy | Board Level | Square, Angled Fins | 0.906" (23.00mm) | - | BGA | Clip | 0.650" (16.51mm) | 5.08°C/W @ 200 LFM | - | Black Anodized | ||||
VIEW |
3,402
In-stock
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Wakefield-Vette | ANCHOR HEATSINK 23X23X12.5MM | Wave 2x | Active | Aluminum Alloy | Board Level | Square, Angled Fins | 0.906" (23.00mm) | - | BGA | Clip | 0.492" (12.50mm) | 6.76°C/W @ 200 LFM | - | Black Anodized |