- Shape :
- Package Cooled :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
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2 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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GLOBAL STOCKS | |||||||||||||||||||||
VIEW |
1,162
In-stock
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level | Square | 0.790" (20.07mm) | 0.790" (20.07mm) | BGA | Thermal Tape, Adhesive (Not Included) | 0.155" (3.94mm) | 1.0W @ 40°C | 20.00°C/W @ 200 LFM | - | Black Anodized | ||||
VIEW |
3,788
In-stock
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 TAB/CLIP-ON | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 0.790" (20.07mm) | 1.102" (28.00mm) | TO-220 | Clip and PC Pin | 0.787" (19.99mm) | 1.0W @ 20°C | 6.00°C/W @ 400 LFM | 13.10°C/W | Black Anodized |