- Manufacture :
- Material :
- Shape :
- Attachment Method :
- Height Off Base (Height of Fin) :
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- Thermal Resistance @ Natural :
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9 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
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VIEW |
1,305
In-stock
|
Assmann WSW Components | HEATSINK ALUM ANOD | - | Obsolete | Aluminum | Board Level, Vertical | Rectangular | 0.787" (20.00mm) | 0.984" (25.00mm) | - | TO-220 | PC Pin | 0.394" (10.00mm) | - | - | 35.00°C/W | Tin | |||
|
VIEW |
2,432
In-stock
|
Comair Rotron | HEATSINK STAMP 26.2X12.7X9.9MM | - | Obsolete | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | - | TO-263 (D²Pak) | SMD Pad | 0.390" (9.91mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | - | Tin | |||
|
VIEW |
3,874
In-stock
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Comair Rotron | HEATSINK STAMP 22.9X8X10.2MM | - | Obsolete | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | - | Tin | |||
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|
VIEW |
2,446
In-stock
|
Comair Rotron | HEATSINK STAMP 25.9X15X9.5MM | - | Obsolete | Copper | Board Level | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | - | TO-263 (D²Pak) | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | |||
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|
VIEW |
1,746
In-stock
|
Comair Rotron | HEATSINK STAMP 19.4X25.4X11.4MM | - | Obsolete | Copper | Board Level | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 1.5W @ 20°C | 4.00°C/W @ 200 LFM | - | Tin | |||
|
VIEW |
2,521
In-stock
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Comair Rotron | HEATSINK STAMP 25.4X12.7X30MM | - | Obsolete | Copper | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | - | Tin | |||
|
VIEW |
2,020
In-stock
|
Comair Rotron | HEATSINK STAMP 13.1X13.2X24MM | - | Obsolete | Copper | Board Level, Vertical | Rectangular, Fins | 0.848" (21.55mm) | 0.520" (13.21mm) | - | TO-220 | Clip and PC Pin | 0.515" (13.08mm) | 0.5W @ 20°C | 12.00°C/W @ 500 LFM | - | Tin | |||
|
VIEW |
2,933
In-stock
|
Comair Rotron | HEATSINK STAMP 9.5X22X28MM | - | Obsolete | Copper | Board Level, Vertical | Rectangular, Fins | 1.100" (27.94mm) | 0.866" (22.00mm) | - | TO-220 | Clip and PC Pin | 0.375" (9.52mm) | 1.5W @ 40°C | 8.00°C/W @ 400 LFM | - | Tin | |||
|
VIEW |
900
In-stock
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Wakefield-Vette | HEATSINK DPAK SMT TIN PLATED | 217 | Obsolete | Copper | Top Mount | Rectangular | 0.740" (18.80mm) | 0.600" (15.24mm) | - | D²Pak (TO-263), SOL-20, SOT-223, TO-220 | SMD Pad | 0.360" (9.14mm) | 1.0W @ 55°C | 16.00°C/W @ 200 LFM | 55.00°C/W | Tin | |||
