Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Width Package Cooled Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
2,446
In-stock
Comair Rotron HEATSINK STAMP 25.9X15X9.5MM - Obsolete Copper Board Level Rectangular, Fins 0.590" (15.00mm) 1.020" (25.91mm) TO-263 (D²Pak) SMD Pad 0.375" (9.52mm) 2.0W @ 40°C 5.00°C/W @ 400 LFM - Tin
Default Photo
RFQ
VIEW
RFQ
2,298
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEATSINK .375" D2PAK - Active Copper Top Mount Rectangular, Fins 0.590" (15.00mm) 1.020" (25.91mm) TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 SMD Pad 0.375" (9.52mm) 2.0W @ 40°C 5.00°C/W @ 400 LFM - Tin
HSS-C2591-SMT-TR
RFQ
VIEW
RFQ
2,839
In-stock
CUI Inc. HEAT SINK, STAMPING, TO-263, 14. - Active Copper Top Mount Rectangular, Fins 0.590" (15.00mm) 1.020" (25.91mm) TO-263 (D²Pak) - 0.375" (9.52mm) 2.1W @ 75°C 8.15°C/W @ 200 LFM 35.71°C/W Tin
7106DG
RFQ
VIEW
RFQ
3,886
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEATSINK .375" D2PAK - Active Copper Top Mount Rectangular, Fins 0.590" (15.00mm) 1.020" (25.91mm) TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 SMD Pad 0.375" (9.52mm) 2.0W @ 40°C 5.00°C/W @ 400 LFM - Tin