- Material :
- Package Cooled :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
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11 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||
|
VIEW |
3,492
In-stock
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Clip and PC Pin | 0.500" (12.70mm) | 2.0W @ 40°C | 8.00°C/W @ 500 LFM | 18.00°C/W | Tin | |||
|
VIEW |
1,001
In-stock
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 COPPER W/TAB | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Bolt On and Board Mounts | 0.500" (12.70mm) | - | 13.00°C/W @ 200 LFM | 18.00°C/W | Tin | |||
|
VIEW |
1,586
In-stock
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Advanced Thermal Solutions Inc. | HEATSINK TO-263 COPPER | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D²Pak) | - | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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|
VIEW |
1,825
In-stock
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Advanced Thermal Solutions Inc. | HEATSINK TO-263 COPPER | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D²Pak) | - | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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|
VIEW |
3,384
In-stock
|
Advanced Thermal Solutions Inc. | HEATSINK TO-263 COPPER | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D²Pak) | - | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | |||
|
VIEW |
2,371
In-stock
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Assmann WSW Components | HEATSINK ALUM ANOD | - | Active | Aluminum | Top Mount | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | Clip and Board Mounts | 0.335" (8.50mm) | - | - | 18.00°C/W | Tin | |||
|
VIEW |
1,856
In-stock
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Advanced Thermal Solutions Inc. | HEATSINK TO-263 COPPER | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D²Pak) | - | 0.402" (10.21mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | |||
|
VIEW |
701
In-stock
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Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSINK .4" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin | |||
|
VIEW |
3,491
In-stock
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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|
VIEW |
2,852
In-stock
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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|
VIEW |
3,966
In-stock
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | |||
