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- Part Status :
- Material :
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- Package Cooled :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Material Finish :
3 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||
|
VIEW |
2,020
In-stock
|
Comair Rotron | HEATSINK STAMP 13.1X13.2X24MM | - | Obsolete | Copper | Board Level, Vertical | Rectangular, Fins | 0.848" (21.55mm) | 0.520" (13.21mm) | - | TO-220 | Clip and PC Pin | 0.515" (13.08mm) | 0.5W @ 20°C | 12.00°C/W @ 500 LFM | Tin | |||
|
VIEW |
1,074
In-stock
|
Wakefield-Vette | HEATSINK CPU 25MM SQ W/DBL TAPE | 625 | Obsolete | Aluminum | Top Mount | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | BGA | Thermal Tape, Adhesive (Included) | 0.250" (6.35mm) | - | 12.00°C/W @ 500 LFM | Black Anodized | |||
|
VIEW |
2,148
In-stock
|
Wakefield-Vette | HEATSINK CPU 25MM SQ W/DBL TAPE | 625 | Active | Aluminum | Top Mount | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | BGA | Thermal Tape, Adhesive (Included) | 0.250" (6.35mm) | - | 12.00°C/W @ 500 LFM | Black Anodized | |||
