Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Width Diameter Package Cooled Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
3,320
In-stock
Wakefield-Vette HEATSINK CPU 43MM SQ BLK H=.65" 628 Active Aluminum Top Mount Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) 0.650" (16.51mm) 3.0W @ 20°C 2.00°C/W @ 400 LFM - Black Anodized
655-53AB
RFQ
VIEW
RFQ
3,661
In-stock
Wakefield-Vette HEATSINK CPU 40.6MM SQ H=.525" 655 Active Aluminum Top Mount Square, Pin Fins 1.600" (40.64mm) 1.600" (40.64mm) - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) 0.522" (13.27mm) 4.0W @ 40°C 2.00°C/W @ 400 LFM - Black Anodized
500403B00000G
RFQ
VIEW
RFQ
819
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK TO-3 12W H=1.25" BLK - Active Aluminum Board Level Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) - TO-3 Bolt On 1.250" (31.75mm) 10.0W @ 50°C 2.00°C/W @ 400 LFM 5.00°C/W Black Anodized
628-65AB
RFQ
VIEW
RFQ
1,575
In-stock
Wakefield-Vette HEATSINK CPU 43MM SQ BLK H=.65" 628 Active Aluminum Top Mount Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) 0.650" (16.51mm) 3.0W @ 20°C 2.00°C/W @ 400 LFM - Black Anodized