Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Width Diameter Package Cooled Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
GLOBAL STOCKS
Default Photo
RFQ
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RFQ
3,320
In-stock
Wakefield-Vette HEATSINK CPU 43MM SQ BLK H=.65" 628 Active Aluminum Top Mount Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) 0.650" (16.51mm) 3.0W @ 20°C 2.00°C/W @ 400 LFM - Black Anodized
Default Photo
RFQ
VIEW
RFQ
1,760
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Aluminum Board Level, Vertical Square, Angled Fins 1.750" (44.45mm) 0.490" (12.44mm) - TO-220, TO-218 Bolt On and Board Mounts 1.750" (44.45mm) 4.0W @ 30°C 2.00°C/W @ 400 LFM 6.30°C/W Black Anodized
530402B00150G
RFQ
VIEW
RFQ
3,290
In-stock
Aavid, Thermal Division of Boyd Corporation HEAT SINK 1.75" HIGH RISE TO-220 - Active Aluminum Board Level, Vertical Rectangular, Fins 1.750" (44.45mm) 0.750" (19.05mm) - TO-220 Clip and Board Mounts 1.750" (44.45mm) 4.0W @ 30°C 2.00°C/W @ 400 LFM 6.30°C/W Black Anodized
628-65AB
RFQ
VIEW
RFQ
1,575
In-stock
Wakefield-Vette HEATSINK CPU 43MM SQ BLK H=.65" 628 Active Aluminum Top Mount Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) 0.650" (16.51mm) 3.0W @ 20°C 2.00°C/W @ 400 LFM - Black Anodized