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2 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
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VIEW |
1,110
In-stock
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level | Rectangular | 1.000" (25.40mm) | 0.750" (19.05mm) | - | TO-220 | Clip | 0.350" (8.89mm) | 1.0W @ 30°C | 16.00°C/W @ 200 LFM | 26.00°C/W | Black Anodized | |||
|
VIEW |
3,288
In-stock
|
Wakefield-Vette | HEAT SINK BGA/PGA 16.5X16.5X8.9 | Penguin | Active | Aluminum | Board Level | Square, Fins | 0.650" (16.51mm) | 0.653" (16.59mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.350" (8.89mm) | - | 8.00°C/W @ 500 LFM | - | Black Anodized | |||
