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| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Wakefield-Vette | HEAT SINK BGA/PGA 16.5X16.5X8.9 | Penguin | Active | Aluminum | Board Level | Square, Fins | 0.650" (16.51mm) | 0.653" (16.59mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.350" (8.89mm) | 8.00°C/W @ 500 LFM | Black Anodized | |||
