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| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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CTS Thermal Management Products | HEATSINK CPU W/ADHESIVE 1.01"SQ | BDN | Active | Aluminum | Top Mount | Square, Pin Fins | 1.010" (25.65mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.355" (9.02mm) | 8.00°C/W @ 400 LFM | 26.40°C/W | Black Anodized | |||
