Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Diameter Package Cooled Attachment Method Height Off Base (Height of Fin) Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
GLOBAL STOCKS
BDN09-3CB/A01
RFQ
VIEW
RFQ
3,733
In-stock
CTS Thermal Management Products HEATSINK CPU W/ADHESIVE .91"SQ BDN Active Aluminum Top Mount Square, Pin Fins 0.910" (23.11mm) - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) 0.355" (9.02mm) 9.60°C/W @ 400 LFM 26.90°C/W Black Anodized